Water-cooled radiator, fabrication method thereof and cooling device with radiator

Abstract

The invention discloses a water-cooled radiator, a fabrication method thereof and a cooling device with the radiator. The water-cooled radiator comprises a heat sink and water tanks, wherein the heat sink comprises a groove-shaped metal body and a plurality of cooling fins, the cooling fins are arranged on the body, the metal body is provided with a plurality of water-cooled passages passing through the two ends of the metal body, gaps between grooves and the cooling fins are directly communicated in a pass-through way to form first cooling air ducts in a penetrating way, a second cooling air duct is formed between adjacent two cooling fins, the first cooling air duct and the second cooling air duct are mutually communicated, the bottoms of the cooling fins and the metal body are a continuous integrated structure, the water tanks are arranged at the two opposite ends of the metal body and are provided with water chambers used for accommodating a working liquid, and the water-cooled passages are communicated with the water chambers. The fins and the metal body are the integrated structure, the problems of influence in heat conduction and liquid leakage caused by unfavorable welding are prevented to the greatest extent, the welding process is substituted by integrated molding, the first yield is high, the manufacturing cost is relatively reduced, the cooling efficiency is high in stability, and high consistency is achieved.

Description

technical field [0001] The invention relates to a water-cooled radiator, a manufacturing method thereof, and a radiator with the radiator. Background technique [0002] The radiator is used to speed up the heat dissipation, which can transfer the heat of the heating element to the air and prolong the service life of the heating object. For example, the current electronics industry is developing rapidly, and many electronic devices will involve heat dissipation issues. To dissipate heat from electronic devices, radiators must be used. [0003] The general radiator adopts the structure of heat sink and heat dissipation fan, and it can also achieve better heat dissipation effect by designing a reasonable internal and external structure. However, some electronic systems with high heating power or relatively concentrated heating power density often cannot accommodate a large air-cooled radiator above the heat source or cannot meet the required heat dissipation performance due to...

AI Technical Summary

Problems solved by technology

Before entering the furnace for welding, it is necessary to use various fixtures to assemble and fix the corrugated sheets, pipes, water chambers and other parts. The shape of the joint between the flat pipe and the water chambers at both ends is complicated and there are many dead angles. During welding, there are often missing welds and false welds. The welding part cannot be effectively detected in the production line. After being installed, it has experienced multiple thermal shocks and the resulting thermal expansion and contraction effects, as well as liquid leakage from the virtual soldering part under vibration conditions. It has been a persistent quality problem that has plagued the water cooling industry for many years.

Leakage and lack of water will cause the lack of working fluid and stop the circulation, which will not be able to effectively take away the heat of the water-cooled head, causing damage to components at the slightest, and system crashes and data loss at worst

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