Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Headband used for virtual reality glasses

A technology of virtual reality glasses and headbands, which is applied in the field of virtual reality technology and wearable computing, and can solve the problems of low height, no sensor, easy to cause shaking comfort, etc.

Active Publication Date: 2016-04-06
JINAN ZHONGJING ELECTRONICS TECH
View PDF7 Cites 6 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] (1) First of all, Cardboard only magnifies the display of the mobile phone, and it does not have any sensors
Secondly, Cardboard is only fixed to the user's head by a Velcro, which is easy to cause shaking and not very comfortable to wear.
[0009] (2) Since the Oculus DK2 is not light and the weight is mainly distributed on the face, the user is likely to cause discomfort during use
And OculusDK2 cannot detect physiological parameters, and cannot grasp the user's psychological and physical feelings

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Headband used for virtual reality glasses
  • Headband used for virtual reality glasses
  • Headband used for virtual reality glasses

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0034] The headband for virtual reality glasses provided in the present invention, the headband includes a headband structure and a headband circuit, and is characterized in that: the headband structure includes: an annular protective pad, a long strap arranged horizontally, Short straps set horizontally, vertical straps set vertically; headband circuit includes: EEG signal test electrodes, temperature and humidity module, vibration module, PPG sensor, pressure sensor, lithium battery, main controller, processing circuit and Bluetooth module.

[0035] Such as figure 1 As shown, the headband circuit includes the following: 1.1 is the EEG signal test electrode 1, 1.2 is the EEG signal test electrode 2, 1.3 is the EEG signal test electrode 3, 1.4 is the EEG signal test electrode 4, and 1.5 is the EEG signal test electrode 1. Signal test electrode 5, 1.6 is EEG signal test electrode 6, 1.7 is EEG signal test electrode 7, 1.8 is EEG signal test electrode 8, 1.9 is EEG signal test ...

Embodiment 2

[0044] The microcontroller uses the STM32 processor, model STM32F103RBT6, introduced by ST (Standard Microelectronics). This type of processor is 32-bit RSIC (reduced instruction set), Cortex-M3ARM core, 72Mhz operating frequency, high-speed embedded memory (Flash memory reaches 128Kbytes, SRAM reaches 20Kbytes), there are multiple enhanced I / Os and interfaces connected to Two APB buses. This family provides two 12-bit ADCs, three general-purpose 16-bit timers and a PWM timer. This series also has rich interfaces: 2 I2C and SPI, 3 serial ports, a USB and CAN bus.

[0045] The EEG signal testing electrode is a needle electrode, wherein the length of the microneedle is between 20-100 μm, which can not only penetrate the stratum corneum to obtain effective EEG signals, but also effectively prevent the scalp from being damaged. According to the characteristics of the EEG signal, the amplifier with high input impedance, high common mode rejection ratio and low noise is selected, ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
Lengthaaaaaaaaaa
Login to View More

Abstract

The invention provides a headband used for virtual reality glasses. The headband comprises a headband structure and a headband circuit. The headband structure comprises a circular protection pad, a long band which is transversely arranged, a short band which is transversely arranged, and a vertical band which is vertically arranged. The headband circuit comprises brain electric signal test electrodes, a humiture module, a vibration module, a PPG sensor, a pressure sensor, a lithium battery, a main controller, a processing circuit and a bluetooth module. The headband used for virtual reality glasses is simple in structure, and can accurately measure physiological parameters such as brain electric signals, body temperature, blood oxygen concentration, pulses and nose-bridge bearing pressure.

Description

technical field [0001] The invention relates to virtual reality technology and wearable computing technology, and more specifically, to a headband for virtual reality glasses. Background technique [0002] Virtual reality technology (Virtual Reality, referred to as VR) can simulate the user's sense of hearing, touch, vision and other senses, so that the user can observe the three-dimensional virtual space simulated by the computing device in an all-round and unlimited way, just like being there. . In recent years, with the rapid development of various technologies related to virtual reality technology, various products related to virtual reality emerge in endlessly. [0003] Virtual reality glasses are wearable products for visual entertainment based on virtual reality, which close people's vision and hearing to the outside world, guide users to have a feeling of being in a virtual environment, and allow users to observe the three-dimensional space in a timely and unlimited...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): A61B5/0205A61B5/01A61B5/0476A61B5/145G02B27/01
CPCA61B5/01A61B5/0205A61B5/145A61B5/369G02B27/0176G02B2027/0178
Inventor 王吉
Owner JINAN ZHONGJING ELECTRONICS TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com