Multi-segment temperature soldering packaging device and method for miniature solid laser

A technology for encapsulating devices and fixing lasers, applied in electric heating devices, welding equipment, manufacturing tools, etc., can solve the problems of low assembly efficiency, poor stability, low power, etc., to achieve short cycle times, simple and easy operation, Efficient effect

Active Publication Date: 2016-04-06
FUJIAN CAS CTL PHOTONICS TECH CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] The technical problem to be solved by the present invention is to provide a multi-stage temperature-welded packaging device and pa

Method used

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  • Multi-segment temperature soldering packaging device and method for miniature solid laser
  • Multi-segment temperature soldering packaging device and method for miniature solid laser

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Embodiment Construction

[0025] In order to describe the technical content, structural features, achieved goals and effects of the present invention in detail, the following will be described in detail in conjunction with the embodiments and accompanying drawings.

[0026] refer to figure 1 The multi-stage temperature welding packaging device of a miniature solid-state laser shown includes a substrate 1, a ceramic heating plate 2, and a fixing member; the fixing member includes an optical element 5 and a bracket 4, and the optical element 5 is fixed on the bracket 4 ; The ceramic heating plate 2 is close to the lower surface of the substrate 1; the substrate 1 is fixed on the operating platform with cooling function and high temperature resistance, the substrate 1 is provided with at least one groove 3, and each groove 3 is filled with Solder materials with different melting points, the bracket 4 on which the optical element 5 is fixed is fixed in the groove 3 through the solder material; the side wal...

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Abstract

The invention provides a multi-segment temperature soldering packaging device and method for a miniature solid laser. The device comprises a base plate, a ceramic heating sheet and fixing parts; the fixing parts comprise optical elements and supports, and each optical element is fixed to the corresponding support; the ceramic heating sheet is closely attached to the lower surface of the base plate; the base plate is fixed to an operating platform which has the cooling function and is resistant to high temperature, the base plate is provided with one or more grooves, each groove is filled with soldering materials different in fusion point, and each support to which the corresponding optical element is fixed is fixed into the corresponding groove through the corresponding soldering materials; a thermistor is installed on the side wall of the base plate. The soldering materials adopted in all the grooves are different in temperature, when each fixing part is soldered, the previous fixing part which is soldered ready is not influenced, the fixing parts and the base plate are integrated permanently, and the structure is stable and firm.

Description

technical field [0001] The invention relates to the field of optical assembly and packaging, in particular to a packaging device and packaging method for multi-stage temperature welding of a miniature solid-state laser. Background technique [0002] Laser technology has penetrated into various fields, such as industrial processing, medical equipment, military weapons, biological detection, scientific research and so on. With the development of science and technology, laser technology has gradually entered our lives. Laser display, the pursuit of bright super-large picture, pure color, and high-resolution display effect, has always been a potential requirement for people's visual experience. From the establishment of command and monitoring centers and network management centers to the conduct of video conferencing, academic reports, technical lectures and multi-functional meetings, the desire for large screen, multi-color, high-brightness, and high-resolution display effects...

Claims

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Application Information

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IPC IPC(8): B23K1/00B23K3/00B23K3/04
CPCB23K1/0008B23K3/00B23K3/04
Inventor 梁万国陈立元周煌冯新凯李广伟陈怀熹缪龙邹小林
Owner FUJIAN CAS CTL PHOTONICS TECH CO LTD
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