Fully automatic silicon wafer soldering robot

Abstract

The invention provides a full-automatic silicon wafer tin soldering robot. The full-automatic silicon wafer tin soldering robot comprises a heating welding platform. The heating welding platform comprises a welding platform body internally provided with a vacuum temperature control pool, a constant-temperature heating device arranged inside the vacuum temperature control pool, and a vacuum extraction device communicated with the vacuum temperature control pool. A silicon wafer placement station with multiple vacuum holes is arranged on the upper surface of the welding platform body, and each vacuum hole is communicated with the vacuum temperature control pool. The full-automatic silicon wafer tin soldering robot not only greatly improves the silicon wafer tin soldering efficiency, but also is better in welding effect.

Description

technical field [0001] The invention relates to the field of silicon wafer soldering, in particular to a fully automatic silicon wafer soldering robot. Background technique [0002] As we all know, the existing soldering of photovoltaic silicon wafers is manual assembly, which not only has large errors, but also has very low efficiency. In the previous soldering machine, the silicon chip cannot be fixed on the heating device, which easily leads to inaccurate soldering position of the tin chip, which in turn makes the welding unreliable, which in turn affects the welding effect and produces a large number of defective products. Contents of the invention [0003] The object of the present invention is to provide a fully automatic silicon wafer soldering robot, which not only greatly improves the efficiency of silicon wafer soldering, but also has better welding effect. [0004] The present invention is achieved like this: [0005] A fully automatic silicon wafer soldering ...

AI Technical Summary

Problems solved by technology

[0002] As we all know, the existing soldering of photovoltaic silicon wafers is manually assembled, which not only has large errors, but also is very inefficient.

However, in the previous soldering machine, the silicon chip cannot be fixed on the heating device, which easily leads to inaccurate soldering position of the tin chip, which in turn makes the welding unreliable, which in turn affects the welding effect and produces a large number of defective products.

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