High temperature resistant protective film for PC plate protection and preparation method thereof

A high-temperature-resistant protective film and PC board technology, which is applied in chemical instruments and methods, layered products, synthetic resin layered products, etc., can solve the problems of poor temperature resistance of protective film materials, complicated preparation process, and high adhesion , to achieve the effect of good product release effect, good thickness uniformity and stable adhesion

Inactive Publication Date: 2016-04-06
AMAX MATERIALS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] The existing PP-based protective film for PC boards on the market, due to the poor temperature resistance of the adhesive layer material, has good adhesion at 50-60°C, but the adhesion is too high, which may easily cause poor air bubble removal
When the PC board is plastic-molded, the adhesive force increases too much, the protective film is not easy to tear off from the PC board after forming, the PC board and the protective film are stuck, and the protective film is also easy to tear; and the resistance of the protective film material The temperature is not good, the protective film is easily deformed by heat, and there will be marks on the PC board, which will affect the use of the PC board
Another kind of PP glue-type protective film, although the glue is very thin, it is prone to the problem of residual glue under high temperature
In addition, PP-based adhesive film or PP-based protective film has complex preparation process, high cost, and problems such as material delamination or residual glue in the product at high temperature, resulting in contamination of the product after PC blister molding, high defect rate, and Can not be wiped, easily scrapped

Method used

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  • High temperature resistant protective film for PC plate protection and preparation method thereof
  • High temperature resistant protective film for PC plate protection and preparation method thereof

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Experimental program
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Effect test

Embodiment 2

[0014] Embodiment 2, the surface layer is made of: modified polypropylene 2.4wt%, polyethylene 2.8wt%, polypropylene 14.8wt%; the middle layer is made of: polyethylene 60wt%; the adhesive layer is made of: high temperature resistant polyethylene 2wt%, Metallocene polymer 18wt%.

Embodiment 3

[0015] Embodiment 3, the surface layer is composed of: modified polypropylene 1.8wt%, polyethylene 1.8wt%, polypropylene 16.4wt%; the middle layer is composed of: polyethylene 60wt%; the adhesive layer is composed of: high temperature resistant polyethylene 8wt%, Metallocene polymer 12wt%.

Embodiment 4

[0016] Example 4, the surface layer is composed of: modified polypropylene 1.8wt%, polyethylene 3.4wt%, polypropylene 14.8wt%; the middle layer is composed of: polyethylene 60wt%; adhesive layer: high temperature resistant polyethylene 8wt%, metallocene Polymer 12wt%.

[0017] It is worth mentioning that the purpose of adding modified polypropylene to the surface layer of the present invention is as follows: 1. To play a release function, improve the roughness of the surface layer of the product, and prevent the product from stacking after the PC board is pasted. 2. Improve the compatibility between the surface layer material and the middle layer material, and avoid the delamination of the material during blister molding.

[0018] The purpose of adding polyethylene in the middle layer is to reduce the hardness of the product and reduce the cost of the product.

[0019] The purpose of adding high-temperature-resistant polyethylene to the adhesive layer material is to improve t...

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Abstract

The invention provides a high temperature resistant protective film for PC plate protection and a preparation method thereof. The protective film contains a surface layer, an intermediate layer and an adhesive layer; and the surface layer and the adhesive layer are on both sides of the intermediate layer. The surface layer consists of 1.8-2.4 wt% of modified polypropylene, 1.8-3.4 wt% of PE and 14.8-16.4wt% of polypropylene; the intermediate layer consists of 60 wt% of polyethylene; and the adhesive layer is formed by 2-8 wt% of high temperature polyethylene and 12%-18 wt% of a metallocene polymer. The high temperature resistant protective film for PC plate protection completely fits without any air bubbles in the affixing and plastic molding process; and sticking or tear does not occur after the plastic molding, and problems of precipitation or residual adhesive can be avoided. The preparation method is simple and uses a T-shaped three-layer co-extruded casting machine for one-time coextrusion molding; and the protective film has the advantages of good thickness uniformity, adhesion stability, good release effect of product, and low cost.

Description

technical field [0001] The invention relates to a protective film, more specifically to a high temperature resistant protective film for PC board protection and a preparation method thereof. Background technique [0002] The PP-based protective film for PC boards currently on the market has good adhesion at 50-60°C due to the poor temperature resistance of the adhesive layer material, but the high adhesive force may easily cause poor air bubble removal. When the PC board is plastic-molded, the adhesive force increases too much, the protective film is not easy to tear off from the PC board after forming, the PC board and the protective film are stuck, and the protective film is also easy to tear; and the resistance of the protective film material The temperature is not good, the protective film is easily deformed by heat, and there will be marks on the PC board, which will affect the use of the PC board. Another kind of PP glue-type protective film, although the glue is very...

Claims

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Application Information

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IPC IPC(8): C08L23/12C08L23/10C08L23/06C08L23/02B32B27/32
CPCC08L23/12B32B27/32B32B2307/306B32B2323/00B32B2323/04B32B2323/10C08L23/02C08L2201/08C08L2203/16C08L2205/02C08L2205/03C08L23/10C08L23/06
Inventor 单春鹏苏荣楠
Owner AMAX MATERIALS TECH CO LTD
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