Unlock instant, AI-driven research and patent intelligence for your innovation.

A device for coating fluorescent powder and its coating method

A fluorescent powder and coating technology, which is applied in the direction of semiconductor devices, electrical components, circuits, etc., can solve the problems of spatial color uniformity and unsatisfactory light efficiency of array LEDs, unsatisfactory light efficiency, and no adjustment of hemispherical curved lenses, etc., to achieve Overcome light effect and color problems, improve spatial color uniformity and light effect, and design ingenious effects

Active Publication Date: 2017-11-17
HUAZHONG UNIV OF SCI & TECH
View PDF4 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, (1) For the multi-chip array LED module, due to its relatively large size, the current array chip LED substrate does not have a boss structure that restricts the excessive spreading of the phosphor glue, so the morphology of the phosphor glue is often planar; ( 2) The multi-chip array LED does not have a hemispherical curved lens to adjust the light output, which causes the spatial color uniformity and light efficiency of the array LED to be unsatisfactory
[0006] Therefore, it is necessary to develop a method or device that can effectively solve the problem of spatial color uniformity of multi-chip array LEDs and the problem of unsatisfactory light efficiency.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A device for coating fluorescent powder and its coating method
  • A device for coating fluorescent powder and its coating method
  • A device for coating fluorescent powder and its coating method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0063] In this embodiment, phosphor glue is applied to the traditional single-chip LED substrate without bosses, the traditional single-chip LED substrate with bosses, and the combination substrate proposed by the present invention.

[0064] image 3 (a) is the appearance of the fluorescent powder glue coated on the traditional single-chip LED substrate without bosses. In this figure, the size of the chip 1001 is 1mm x 1mm, and the thickness is 0.1mm; the size of the substrate 1004 6mm x 6mm and 1mm thick. Since there is no restriction on the flow and spread of the phosphor glue by the boss, the phosphor glue is close to the state of completely wetting the substrate, and a thin layer of phosphor glue layer is formed above the chip and the substrate. The shape of the phosphor glue is called circular. Pie shape.

[0065] image 3 (b) is the appearance of the fluorescent powder glue obtained by coating the phosphor glue on the traditional single-chip LED substrate with a boss,...

Embodiment 2

[0069] In this embodiment, phosphor glue is applied to the conventional multi-chip array LED substrate, the circular multi-chip array combined substrate structure and the rectangular multi-chip array combined substrate structure respectively.

[0070] Figure 4 (a) is a traditional multi-chip array LED substrate, Figure 4 (b) is a circular multi-chip array assembly substrate, Figure 4 (c) is a rectangular multi-chip array assembly substrate.

[0071] Figure 5 (a) is the morphology of the phosphor powder glue coated on the traditional multi-chip array LED substrate. Due to the large coating area of ​​the traditional array LED substrate, in order to ensure that the phosphor powder glue will not be excessively spread to form a thin layer, often A dike 1009 of a certain height is added on the periphery of the chip to limit the spread of the phosphor glue, but due to the large area and no effective shape control method, the phosphor glue has a planar shape.

[0072] Figure...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
thicknessaaaaaaaaaa
concentrationaaaaaaaaaa
thicknessaaaaaaaaaa
Login to View More

Abstract

The invention discloses a coating apparatus and a coating method for phosphor powder, and belongs to the LED (light emitting diode) packaging field. The apparatus comprises a base plate, a supporting block and a phosphor powder gum coating plate; the base plate adopts a flat plate shape; the supporting block is used for supporting the phosphor powder gum coating plate on the base plate; the total area of the contact end parts of the supporting block and the phosphor powder gum coating plate is S1; the total area of the contact surfaces of the phosphor powder gum coating plate and the supporting block is S2; S1:S2 is less than or equal to 0.9; the phosphor powder gum coating plate is parallel with the base plate, or the phosphor powder gum coating plate is not parallel with the phosphor powder gum coating plate; the minimum distance between the phosphor powder gum coating plate and the base plate is 0.1mm; the phosphor powder gum coating plate adopts a flake shape; the flake-shaped thickness of the phosphor powder gum coating plate is 0.01-1mm; and circuits are printed on a gum-coating surface of the phosphor powder gum coating plate. The invention also discloses a coating method by using the coating apparatus. The coating apparatus endows array chips with semispherical or spherical phosphor powder gum appearances in an array chip packaging process.

Description

technical field [0001] The invention belongs to the field of LED packaging, and more specifically relates to a device for coating fluorescent powder and a method for coating LED fluorescent powder glue. Background technique [0002] LED (Light Emitting Diode) is a semiconductor light-emitting device based on the principle of P-N junction electroluminescence. It has the advantages of high electro-optical conversion efficiency, long service life, environmental protection and energy saving, and small size. It is known as the green lighting source in the 21st century. Due to the unique advantages of LED, it has been widely used in many fields, and is considered by the industry to be the main development direction of lighting technology in the future, with huge market potential. Currently white LED products are the most widely used. [0003] High-power white LEDs are usually mixed with two wavelengths of blue light and yellow light or three-wavelength light of blue light, green ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/50H01L33/00
CPCH01L33/005H01L33/50H01L33/501H01L2933/0025H01L2933/0033H01L2933/0041H01L2933/005
Inventor 罗小兵余兴建谢斌商博锋马预谱
Owner HUAZHONG UNIV OF SCI & TECH