A kind of manufacturing method of pcb board with built-in active device

Abstract

The invention discloses a manufacturing method of a PCB board internally provided with an active device. The method comprises the steps of: laminated and stacked structure designing, manufacturing of a component mounting surface of an internal core plate, internal core plate surface mounting, laminating and molding, post-processing and the like. The manufacturing method of the PCB board internally provided with the active device has the advantages that the reliability is high, the machining precision is high, the quality stability is good and the practicability is high.

Description

technical field [0001] The invention relates to the field of PCB circuit board manufacture, in particular to a method for manufacturing a PCB board with built-in active devices. Background technique [0002] At present, in order to solve the small size of the traditional PCB board, it cannot meet the increasing demand for component placement, and after the traditional PCB is placed, the components are placed outside, forming electromagnetic interference with each other, and are easily damaged by external factors. For the problem of scrapping, built-in device technology has emerged, which can effectively solve the above problems. [0003] Built-in active device PCB can well meet the development trend of light, thin and small PCB, but this technology has extremely high requirements on equipment and manufacturing process, and there are many technical difficulties. It is still in the initial test and sample processing and production stage in China. , very few manufacturers can ...

AI Technical Summary

Problems solved by technology

[0002] At present, in order to solve the small size of the traditional PCB board, it cannot meet the increasing demand for component placement, and after the traditional PCB is placed, the components are placed outside, forming electromagnetic interference with each other, and are easily damaged by external factors. The problem of scrapping, the emergence of built-in device technology can effectively solve the above problems

[0003] Built-in active device PCB can well meet the development trend of light, thin and small PCB, but this technology has extremely high requirements on equipment and manufacturing process, and there are many technical difficulties. It is still in the initial test and sample processing and production stage in China. , very few manufacturers can apply this technology in actual mass production

Most of the processing methods in the industry are processed according to the following process: inner layer graphics production → inner layer pad solder paste printing → inner layer pad paste components → cleaning the inner layer surface → lamination → normal multi-layer board production, the process flow It is impossible to effectively control the accuracy of thin plate placement and the reliability of lamination, which directly affects the reliability of components and the reliability of the PCB board itself

[0004] Problems that are prone to occur when using traditional processing methods are: due to the small thickness of the inner core board, bending and vibration occur during the SMT production process, which seriously affects the placement accuracy of the device; the surface of the board after placement is polluted, resulting in the combination with the prepreg The force is poor, and it is easy to delaminate and explode; the poor design of the window opening of the prepreg causes the window to be too small and the device cannot be embedded in the middle of the PP slot, resulting in poor protrusions and device damage. The problem of voids and cracks affects the quality of the product and increases the production risk of the enterprise

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