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Reflow soldering template, template component, tin paste printing device and reflow soldering method

A technology of reflow soldering and solder paste printing, which is used in the assembly of printed circuits with electrical components, printed circuits, and printed circuit manufacturing. The number of welding and the effect of reducing labor costs

Inactive Publication Date: 2016-04-13
CHANGSHA GREE HVAC EQUIP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The main purpose of the present invention is to provide a template for reflow soldering, a template assembly, a solder paste printing device and a reflow soldering method to solve the problems of low production efficiency and high labor cost of circuit boards caused by wave soldering in the prior art

Method used

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  • Reflow soldering template, template component, tin paste printing device and reflow soldering method
  • Reflow soldering template, template component, tin paste printing device and reflow soldering method
  • Reflow soldering template, template component, tin paste printing device and reflow soldering method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0052] Solder paste printing, wherein the shape of the drainage funnel corresponding to the annular through hole is circular, and the shape of the stencil window is also circular, and the outer diameter of the annular through hole is equal to the inner diameter of the drainage funnel and the inner diameter of the window. The shape of the drainage funnel with a square through hole is square, and the shape of the steel mesh window is also square, and the outer diameter of the through hole is equal to the inner diameter of the drainage funnel and the inner diameter of the window, and the maximum cross-sectional area of ​​the drainage funnel is equal to its height. The ratio is 1.4:1, the height of the drainage funnel is 2mm, the distance between the scraper and the reflow soldering template is 0.3mm, and the thickness of the steel mesh is 1mm;

[0053] Plug-ins, inserting components that have been cut into the through-holes printed with solder paste;

[0054] For reflow soldering...

Embodiment 2

[0056] Solder paste printing, wherein the shape of the drainage funnel corresponding to the annular through hole is circular, and the shape of the stencil window is also circular, and the outer diameter of the annular through hole is equal to the inner diameter of the drainage funnel and the inner diameter of the window. The shape of the drainage funnel with a square through hole is square, and the shape of the steel mesh window is also square, and the outer diameter of the through hole is equal to the inner diameter of the drainage funnel and the inner diameter of the window, and the maximum cross-sectional area of ​​the drainage funnel is equal to its height. The ratio is 1.4:1, the height of the drainage funnel is 3mm, the distance between the scraper and the reflow soldering template is 0.2mm, and the thickness of the steel mesh is 1mm;

[0057] Plug-ins, inserting components that have been cut into the through-holes printed with solder paste;

[0058] For reflow soldering...

Embodiment 3

[0060] Solder paste printing, wherein the shape of the drainage funnel corresponding to the annular through hole is circular, and the shape of the stencil window is also circular, and the outer diameter of the annular through hole is equal to the inner diameter of the drainage funnel and the inner diameter of the window. The shape of the drainage funnel with a square through hole is square, and the shape of the steel mesh window is also square, and the outer diameter of the through hole is equal to the inner diameter of the drainage funnel and the inner diameter of the window, and the maximum cross-sectional area of ​​the drainage funnel is equal to its height. The ratio is 1.4:1, the height of the drainage funnel is 4mm, the distance between the scraper and the reflow soldering template is 0.1mm, and the thickness of the steel mesh is 1mm;

[0061] Plug-ins, inserting components that have been cut into the through-holes printed with solder paste;

[0062] For reflow soldering...

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Abstract

The invention provides a reflow soldering template, a template component, a tin paste printing device and a reflow soldering method. The reflow soldering template comprises a template body and drainage funnels. The template body is provided with a first surface which is provided with openings corresponding to through holes under reflow soldering. The drainage funnels are convexly arranged on the first surface of the template body in a way of being corresponding to the openings. The drainage funnels are arranged on the template body of the reflow soldering template so that directional flowing of tin paste can be formed by utilizing the drainage funnels when reflow soldering of the through holes is performed, then the tin paste is enabled to accurately and rapidly enter the through holes to be evenly distributed in the through holes, and thus elements are enabled to be firmly soldered on a circuit board. Therefore, soldering quality of the through holes can be enhanced by the reflow soldering template, the number of times of repair soldering can be reduced, and thus production efficiency of the circuit board can be enhanced, and labor cost consumed in detection and repair soldering can be reduced.

Description

technical field [0001] The invention relates to the field of circuit board preparation, in particular to a reflow soldering template, a template component, a solder paste printing device and a reflow soldering method. Background technique [0002] Circuit boards are commonly used parts in household appliances, so their demand is large. At present, the through-hole welding of circuit boards is generally wave soldering, but the one-time pass rate of wave soldering is low, and there are many welding problems. Therefore, It is necessary to arrange personnel to repair leakage welding, and to arrange front-line inspection personnel to detect welding faults in time, which greatly leads to the production efficiency of circuit boards and consumes too much labor cost. Contents of the invention [0003] The main purpose of the present invention is to provide a template for reflow soldering, a template assembly, a solder paste printing device and a reflow soldering method to solve the...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/34
CPCH05K3/3494H05K2203/0139
Inventor 祁恒王红亮陈烔颜晶查学明王力强谢倜中王晓彬周艳彬方掩
Owner CHANGSHA GREE HVAC EQUIP CO LTD