Quartz bonding method based on gold-tin co-crystal

A quartz and bonding technology, applied in the field of bonding between quartz structures, can solve the problems of affecting the bonding effect, difficult to control the amount of glue, unable to ensure the uniformity of colloid coverage, etc., and achieve the effect of precise alignment

Inactive Publication Date: 2016-04-20
BEIJING AUTOMATION CONTROL EQUIP INST
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  • Abstract
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  • Claims
  • Application Information

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Problems solved by technology

The adhesive bonding process is simple and easy to implement, but there are the following problems: ①Whether manual or mechanical gluing is used, the uniformity of colloid coverage cannot be guaranteed; ②The fluidity of the colloid b

Method used

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  • Quartz bonding method based on gold-tin co-crystal
  • Quartz bonding method based on gold-tin co-crystal
  • Quartz bonding method based on gold-tin co-crystal

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Embodiment Construction

[0035] Hereinafter, the present invention will be further described with reference to the drawings and specific embodiments.

[0036] The present invention provides a method for bonding between quartz based on gold-tin eutectic, which can meet the problems of the prior art.

[0037] Taking the three-layer quartz sensitive structure as an example, the bonding method of the multi-layer quartz sensitive structure can be analogized. The three-layer quartz sensitive structure adopts two-by-two bonding, that is, one of the parts 11 on both sides and the middle part 12 are bonded into a pair, and then the two parts 13 on both sides are bonded on it; the bonding agent adopts The layered gold-tin eutectic solder 14, according to the principle of TLP, adopts a method of alternately depositing multiple layers of gold-tin thin films to prepare the eutectic solder layer 14.

[0038] The present invention is mainly aimed at Au-Sn-Au three-layer eutectic solder, the overall thickness of the solder...

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Abstract

The invention relates to a quartz bonding method based on gold-tin co-crystal. The method comprises the following steps: preparing materials; cleaning the prepared materials; depositing thin films: depositing a Cr/Au thin film on one (11) of two parts on the lateral sides in sequence, depositing a Cu/Au/Sn/Au thin film on one side, which is corresponding to the part (11), of a middle part (12), then depositing a Cr/Au thin film on the other one (13) of two parts on the lateral sides in sequence, depositing a Cr/Au/Sn/Au thin film on the other side, which is corresponding to the part (13), of the middle part (12) in sequence; and carrying out thermo-compression bonding. The provided method can precisely control the ratio of components of a solder layer, can achieve precise processing of patterned solder, and is capable of precisely aligning quartz sensitive structural members.

Description

Technical field [0001] The invention relates to a bonding technology between quartz structures, in particular to a quartz bonding method based on gold-tin eutectic. technical background [0002] Quartz crystal is an important piezoelectric material, which can be widely used in various military and civilian fields such as communications, inertial navigation, automatic control, and electronic watches. The basic working principle of quartz piezoelectric devices is based on the piezoelectric effect of quartz crystals, and the mechanical quantities such as acceleration and angular velocity are converted into electrical signals for detection. In order to realize the working principle of the quartz piezoelectric device, it is usually necessary to combine the quartz components of the multilayer structure to form a quartz sensitive structure component, which is a key component of the sensitive mechanical quantity. Multi-layer quartz sensitive structural parts require that the zero-layer ...

Claims

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Application Information

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IPC IPC(8): C03C27/08
Inventor 刘韧杨军丁凯孙刚唐琼车一卓苏翼
Owner BEIJING AUTOMATION CONTROL EQUIP INST
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