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Electronic device and radiating casing thereof

A casing and electronic component technology, applied in the field of electronic devices and their heat dissipation casings, can solve the problems of large volume and thickness, which cannot meet the needs of ultra-thin electronic products, so as to save space, meet the needs of ultra-thin, high The effect of cooling efficiency

Inactive Publication Date: 2016-04-20
中山市云创知识产权服务有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this electronic device has a large structural volume and thickness due to the inclusion of a fan, etc.
Therefore, the heat dissipation design of this electronic device can no longer meet the ultra-thin requirements of electronic products
In addition, the casings of electronic devices in the prior art cannot be directly used to dissipate the heat generated by heat-generating electronic components.

Method used

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  • Electronic device and radiating casing thereof
  • Electronic device and radiating casing thereof
  • Electronic device and radiating casing thereof

Examples

Experimental program
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Effect test

Embodiment Construction

[0016] Please refer to Figure 1 to Figure 3 The electronic device 100 according to the first embodiment of the present invention includes a heat dissipation case 10 and two heat generating electronic components 20 , 30 combined with the heat dissipation case 10 through heat conduction.

[0017] The cooling case 10 includes a top plate 12 , a bottom plate 14 , a pore structure 16 and a working medium 18 between the top plate 12 and the bottom plate 14 .

[0018] The materials of the top plate 12 and the bottom plate 14 can be copper, aluminum, titanium, nickel and other metal materials with good thermal conductivity. The top board 12 is located inside the electronic device 100 , and the bottom board 14 is located outside the electronic device 100 . The opposite ends of the top board 12 and the bottom board 14 are raised upwards, and the cross-sections of the raised two ends are arc-shaped. An outer edge of the top plate 12 is connected to an outer edge of the bottom plate 14...

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PUM

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Abstract

The invention relates to an electronic device. The electronic device includes a radiating casing and a heating electronic component which is in heat conduction combination with the radiating casing, wherein an enclosed cavity is formed in the radiating casing; working mediums and a pore structure for absorbing the working mediums are accommodated in the cavity; and the heat generated from the heating electronic component can be radiated through phase change circulation of the working mediums. In the electronic device, as the enclosed cavity is formed in the radiating casing; the working mediums and the pore structure for absorbing the working mediums are accommodated in the cavity; and the heat generated from the heating electronic component can be radiated through phase change circulation of the working mediums, radiating assemblies, such as fans, radiating fins and heat pipes are saved and the space of the electronic device is saved, so that higher radiating efficiency can be guaranteed and the ultrathin requirement for electronic products can be satisfied.

Description

technical field [0001] The invention relates to an electronic device and its heat dissipation casing. Background technique [0002] The heat dissipation design of electronic devices such as computers has been completed using heat dissipation modules. The heat dissipation module includes structures such as fans, heat pipes, and fins, which take heat out of heat-generating electronic components such as central processing units and graphics card chips through heat pipes, and then dissipate the heat through fans and fins. However, the electronic device has a relatively large structural volume and thickness due to the fans and the like. Therefore, the heat dissipation design of the electronic device can no longer meet the ultra-thin requirements of electronic products. In addition, the housing of the electronic device in the prior art cannot be directly used to dissipate the heat generated by the heat-generating electronic components. Contents of the invention [0003] In vi...

Claims

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Application Information

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IPC IPC(8): H05K7/20H05K5/06
CPCH05K7/20336G06F1/203
Inventor 吴佳鸿代升亮
Owner 中山市云创知识产权服务有限公司
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