Electronic device and radiating casing thereof
A casing and electronic component technology, applied in the field of electronic devices and their heat dissipation casings, can solve the problems of large volume and thickness, which cannot meet the needs of ultra-thin electronic products, so as to save space, meet the needs of ultra-thin, high The effect of cooling efficiency
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[0016] Please refer to Figure 1 to Figure 3 The electronic device 100 of the first embodiment of the present invention includes a heat dissipation housing 10 and two heat-generating electronic components 20 and 30 that are thermally combined with the heat dissipation housing 10.
[0017] The heat dissipation casing 10 includes a top plate 12, a bottom plate 14, a pore structure 16 between the top plate 12 and the bottom plate 14, and a working medium 18.
[0018] The material of the top plate 12 and the bottom plate 14 may be metal materials with good thermal conductivity such as copper, aluminum, titanium, and nickel. The top board 12 is located inside the electronic device 100, and the bottom board 14 is located outside the electronic device 100. The opposite ends of the top plate 12 and the bottom plate 14 are tilted upward, and the cross sections of the tilted ends are both arc-shaped. The outer edge of the top plate 12 and the outer edge of the bottom plate 14 are connected...
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