Method for detecting whether wafer position inclines during baking process

A wafer tilting technology, applied in semiconductor/solid-state device manufacturing, semiconductor/solid-state device testing/measurement, electrical components, etc. To solve problems such as the normal use of the station, achieve the effects of high accuracy, convenient detection, and small temperature drop

A wafer tilting technology, applied in semiconductor/solid-state device manufacturing, semiconductor/solid-state device testing/measurement, electrical components, etc. To solve problems such as the normal use of the station, achieve the effects of high accuracy, convenient detection, and small temperature drop

CN105529280AInactive Publication Date: 2016-04-27WUHAN XINXIN SEMICON MFG CO LTD
4 Cites 5 Cited by

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Method for detecting whether wafer position inclines during baking process

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0026] The principles and features of the present invention are described below in conjunction with the accompanying drawings, and the examples given are only used to explain the present invention, and are not intended to limit the scope of the present invention.

[0027] like figure 1 As shown, a method for detecting whether the wafer position is tilted in the baking process includes the following steps:

[0028] Step 1, during the baking process of the wafer to be detected, monitor the temperature change of the hot plate, and generate a time curve reflecting the temperature change of the hot plate;

[0029] Step 2, comparing the time curve with the existing normal time curve of the same type to determine whether the position of the wafer to be detected is tilted.

[0030] The existing normal time curve is statistically fitted from the time curves generated by a plurality of wafers of the same specification with the same specification as the wafer to be detected, and the bak...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to a method for detecting whether a wafer position inclines or not during the baking process. The method comprises the following steps of monitoring temperature change situation of a hot plate during the baking process of a wafer to be detected, and generating a time curve reflecting the temperature change situation of the hot plate; and comparing the time curve with the already-had normal time curve of a similar type, and judging whether the position of the wafer to be detected inclines or not. By the method, the wafer of which the position inclines is randomly monitored in real time, the scrapped rate caused by unfavorable wafers is reduced, and the method is convenient in detection and high in accuracy; and moreover, a position inclination sensing device is not needed to be arranged, and the cost is reduced.

Description

technical field [0001] The invention relates to the technical field of semiconductor photolithography, in particular to a method for detecting whether the position of a wafer is tilted during a baking process. Background technique [0002] In the photolithography process, in order to precisely control the pattern size, the accuracy and uniformity of the baking temperature of the photoresist coated on the wafer are very high. However, if the position of the wafer is tilted during the baking process, the wafer is heated unevenly, which will lead to uneven baking temperature of the photoresist coated on the wafer. Therefore, it is very important that the position of the wafer is not tilted during the baking process. [0003] Most of the baking chambers of existing glue-coating and developing machines do not have wafer position tilt sensing devices, and the machine will alarm only when the wafer position is tilted to a serious degree; only a few are equipped with wafer position...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
27 Apr 2016
Publication
CN105529280A
IPC
H01L21/66; H01L21/3105
CPC
H01L22/12; H01L21/31058
Inventors
陈忠奎