Multifunctional mobile phone heat-dissipation housing

A technology for heat dissipation and heat dissipation shell of mobile phone, applied in the direction of telephone structure, cooling/ventilation/heating transformation, telephone communication, etc. Low cost and simple operation

Inactive Publication Date: 2016-04-27
SHANGHAI INST OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] In the past, there are mainly the following types of heat-dissipating mobile phone cases: ① adding some kind of heat-conducting fluid or electrolyte, the disadvantage is that a little careless operation may lead to fluid leakage, corrosion of mobile phones and environmental pollution, etc., such as patent publication CN204258876U; ② adding ordinary small The fan and cooling conductor need to be connected to the power supply, which is inconvenient to use, easy to generate noise, and may increase the thickness of the mobile phone case, such as patent publication number CN104902042A; ③Using aluminum peripheral edges, such as patent publication number CN204231427U; ④Built-in solar panels and fans , such as patent publication number CN204795140U, not only the ideal effect is good, but the operation is cumbersome and difficult to popularize.
The material used for the mobile phone case in the above method is still the usual material on the market, and the problem of mobile phone heating is still not completely solved.

Method used

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  • Multifunctional mobile phone heat-dissipation housing

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Embodiment Construction

[0024] Below in conjunction with accompanying drawing, the present invention will be further described as follows:

[0025] As shown in the drawings, the present invention includes: a heat dissipation shell body, the heat dissipation shell body includes a heat dissipation device 12, a patch part and a TPU material side frame 1, the patch part is connected to the TPU material side frame 1, and the patch part includes an inner sticker Chip 4, copper disc 2, aluminum disc 3 and the outer patch, the inner patch 4 is reserved with a number of evenly distributed grooves, the copper disc 2 and the aluminum disc 3 are interlaced and embedded in the groove, the outer The patch is composed of an outer patch 10 made of TPU material and a PC outer patch 11 embedded on the outer patch 10 made of TPU material. The heat sink 12 is placed in the interlayer reserved between the inner patch 4 and the outer patch. The heat dissipation device 12 includes a micro fan 8, an electronic drive 9 and a...

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Abstract

The invention relates to a multifunctional mobile phone heat-dissipation housing, which comprises a heat-dissipation housing main body. The heat-dissipation housing main body comprises a heat-dissipation device (12), a patch portion and a TPU material side frame (1). The patch portion comprises an inner patch (4), copper discs (2), aluminium discs (3) and an outer patch, wherein the copper discs (2) and the aluminium discs (3) are alternatively embedded in a plurality of equally-distributed slots reserved in the inner patch (4). The outer patch is formed by a TPU material outer patch (10) and a PC outer patch (11) embedded in the TPU material outer patch (10). The heat-dissipation device (12) is arranged in an interlayer reserved between the inner patch (4) and the outer patch. The heat-dissipation device (12) comprises miniature fans (8), an electronic drive (9) and an electronic drive protective housing (13). The heat-dissipation housing main body is provided with heat-dissipation holes (5). The mobile phone heat-dissipation housing can dissipate heat by means of the inner patch, the copper discs and the aluminium discs during normal operation, can dissipate heat quickly by starting the miniature fans when the temperature is too high, and is simple to operate.

Description

[technical field] [0001] The invention relates to the technical field of mobile phone spare parts, in particular to a multifunctional mobile phone cooling case, which is especially suitable for the use of today's large-screen smart phones. [Background technique] [0002] In the past, there are mainly the following types of heat-dissipating mobile phone cases: ① adding some kind of heat-conducting fluid or electrolyte, the disadvantage is that a little careless operation may lead to fluid leakage, corrosion of mobile phones and environmental pollution, etc., such as patent publication CN204258876U; ② adding ordinary small The fan and cooling conductor need to be connected to the power supply, which is inconvenient to use, easy to generate noise, and may increase the thickness of the mobile phone case, such as patent publication number CN104902042A; ③Using aluminum peripheral edges, such as patent publication number CN204231427U; ④Built-in solar panels and fans , as Patent Pub...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04M1/02H05K7/20
CPCH04M1/0279H05K7/20136H05K7/20436
Inventor 范学锋冯劲梅陈彬刘文
Owner SHANGHAI INST OF TECH
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