Laser cutting method for microwave absorbing material

A microwave-absorbing material and laser cutting technology, applied in laser welding equipment, welding equipment, metal processing equipment, etc., can solve the problems of high processing cost, easy deformation of materials, long cycle and unsuitable product development, etc., to achieve thermal deformation and thermal influence The effect of small area, simplified clamping tools and fast processing speed

Inactive Publication Date: 2016-05-04
GUIZHOU AEROSPACE ELECTRONICS TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For trial products, manufacturing molds can make parts have better precision, but the processing cost of parts is relatively high, and the cycle of mold manufacturing is also long, which is not suitable for product research and development, but shortened by conventional processing methods (sheet metal workers manual cutting) The manufacturing cycle of the parts is shortened, but the material is easily deformed, and many parts after processing cannot reach the standard size and design requirements

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] Example 1: The microwave absorbing part is a thin plate part with a thickness of δ=1.5mm, 8*9 rectangular through holes need to be processed, and the shape is complex and irregular, and the dimensional accuracy is high. After the following steps, the dimensional accuracy of the measured part reaches ±0.02 The surface roughness of mm is 25μm, and the total processing time is only 5.5min.

[0029] (1) Draw electronic graphics according to the design blank size, material and thickness;

[0030] (2) Set the laser cutting parameters: current is 100A, pulse width is 10ms, pulse frequency is 500HZ;

[0031] (3) Choose a shrinking nozzle with a mouth diameter of Φ1.5mm, and place the nozzle position 0.5mm away from the surface of the workpiece;

[0032] (4) Place the laser focus position 1 / 2 below the surface of the material, and adjust the laser power to 2.3KW;

[0033] (5) Open the auxiliary gas and open the control valve to adjust the control pressure correctly;

[0034] (6) Cutting t...

Embodiment 3

[0036] Example 3: The microwave absorbing part is a thin plate part, with a thickness of δ=1.5mm, 8*9 rectangular through holes need to be processed, and complex and irregular shapes require high dimensional accuracy. After the following steps, the dimensional accuracy of the measured part reaches ±0.04 The surface roughness of mm is 29μm, and the total processing time is only 5min.

[0037] (1) Draw CAD graphics according to the design blank size, material and thickness;

[0038] (2) Set the laser cutting parameters: current is 200A, pulse width is 15ms, pulse frequency is 600HZ;

[0039] (3) Choose a shrinking nozzle with a mouth diameter of Φ1.5mm, and place the nozzle position 1.0mm away from the surface of the workpiece;

[0040] (4) Place the laser focus position 1 / 2 below the surface of the material, and adjust the laser power to 2.3KW;

[0041] (5) Open the auxiliary gas and open the control valve to adjust the control pressure correctly;

[0042] (6) Cut parts at a speed of 400...

Embodiment 4

[0044] Embodiment 4: The microwave absorbing part is a thin plate part with a thickness of δ=1.5mm, 8*9 rectangular through holes need to be processed, and the shape is complex and irregular, and the dimensional accuracy is high. After the following steps, the dimensional accuracy of the measured part reaches ±0.05 The surface roughness of mm is 30μm, and the total processing time is only 4.6min.

[0045] (1) Draw CAD graphics according to the design blank size, material and thickness;

[0046] (2) Set the laser cutting parameters: current is 350A, pulse width is 20ms, pulse frequency is 1000HZ;

[0047] (3) Choose a shrinking nozzle with a mouth diameter of Φ1.5mm, and place the nozzle at 2.0mm away from the surface of the workpiece;

[0048] (4) Place the laser focus position 1 / 2 below the surface of the material, and adjust the laser power to 2.3KW;

[0049] (5) Open the auxiliary gas and open the control valve to adjust the control pressure correctly;

[0050] (6) Cut the parts at a...

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Abstract

The invention discloses a laser cutting method for a microwave absorbing material. The laser cutting method comprises the following steps: drawing a part structural pattern and then setting laser cutting parameters as follows: current being 100-350A, pulse width being 0-20ms, and pulse frequency being 0-1000HZ; selecting a contracting nozzle with the diameter being Phi1.5mm, and putting the nozzle to a position which is 0.5-2.0mmm away from the surface of a workpiece; putting a laser focal point to a position which is 1/2 below a material surface and regulating laser power to 2.3KW; opening an auxiliary gas control valve to correctly regulate control pressure; cutting a part at a speed of 300-500mm/min, and clearing powder generated by laser cutting by use of alcohol, and drying the part. A surface cut by the laser cutting method is attractive in appearance and is low in roughness; the laser cutting method is high in cutting efficiency and is suitable for cutting parts with different shapes; a thermal deformation and heat-affected zone is small, parts with complex shapes and small parts can be processed, and processing can be carried out in vacuum; and no cutting force is acted on the workpiece, workpiece deformation is not caused, the workpiece can be freely placed, and a clamping tool can be greatly simplified.

Description

Technical field [0001] The invention relates to the field of non-metallic material processing, in particular to a laser cutting method for microwave absorbing materials. Background technique [0002] Microwave absorbing material is a kind of non-metallic material. It has good elasticity and toughness. It can be deformed by a little external force, and the external force can be removed and restored to its original state. The mechanical properties and chemical composition of this kind of material parts are very different from those of metals, which brings certain difficulties to processing. For trial products, manufacturing molds can make the parts have better accuracy, but the processing cost of the parts is relatively high, and the cycle of mold manufacturing is also long. It is not suitable for product research and development, and it is shortened by conventional processing methods (sheet metal workers manual cutting) The manufacturing cycle of the parts is reduced, but the mat...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/38B23K26/402
CPCB23K26/38
Inventor 刘曦
Owner GUIZHOU AEROSPACE ELECTRONICS TECH
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