Two-dimensional thermal wind speed and direction sensor based on ceramic package and its manufacturing method

Abstract

The invention provides a two-dimensional thermal-type wind speed and directions sensor based on ceramic packaging, and a manufacturing method therefor. The sensor comprises a ceramic substrate (1), an embedded silicon substrate (2), an insulating layer (3), a heating element (4), and four symmetric temperature measurement elements. The embedded silicon substrate (2) is embedded into the ceramic substrate (1), and the thickness of the part, above the embedded silicon substrate (2), of the ceramic substrate (1) is less than the whole thickness of ceramic. The embedded silicon substrate (2) is disposed in a cavity of the central ceramic substrate (1) in a central symmetry manner, and the lower surface of the embedded silicon substrate (2) is provided with the insulating layer (3). The lower surface of the insulating layer (3) is provided with the heating element (4) and four orthogonal temperature measurement elements. The sensor improves the sensitivity, and reduces the power consumption.

Description

technical field [0001] The invention is a two-dimensional thermal wind speed and direction sensor based on ceramic packaging, especially a thermal wind speed and direction sensor realized by combining low temperature co-fired ceramics and a silicon substrate. Background technique [0002] In the detection of meteorological information, the monitoring of living environment and the prevention of natural disasters, the information of wind speed and direction plays an important role, so it is of great practical significance to obtain the information of wind speed and direction accurately and quickly. The detection of wind speed and direction in the early days was mainly realized by wind cups and wind vanes, but these devices contain movable parts, so they are easy to wear, and they are large in size, expensive, and require frequent maintenance; although the ultrasonic wind speed sensors that appeared later have high measurement accuracy, there is no The range is limited, but due...

AI Technical Summary

Problems solved by technology

However, in the design of thermal wind speed and direction sensors, silicon or ceramics are usually used as the substrate material, and the thermal conductivity of silicon is very high, which makes the power consumption of this type of sensor larger; the ceramic substrate is used as the sensor support material and also Packaging materials, the sensitivity of the sensor is better than that of the silicon chip and the process is simple, but the flatness of the material and other issues lead to insufficient precision of the components directly made on it, which makes the consistency of the device worse; at present, there is another common packaging method is to paste the silicon sensor chip The protection and sensitivity of the sensor is achieved by installing it on ceramics. However, this method takes into account operational issues. The ceramic substrate should not be too thin, and adhesives need to be used between the ceramic and silicon chips, resulting in large actual power consumption of the device, low thermal response and Consistency and uniformity are difficult to guarantee

Images