Processing method for printing circuit board semi-PTH groove

A technology for printed circuit boards and processing methods, applied in the directions of printed circuits, printed circuit manufacturing, and the formation of electrical connection of printed components, can solve problems such as labor costs, poor adhesion between copper plating and the inner wall of the tank, and product scrapping, etc. Improve product quality, eliminate copper peeling, and eliminate the effect of copper coiling

Inactive Publication Date: 2016-05-04
DALIAN CHONGDA CIRCUIT
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The disadvantages of this method are: 1. There are a large number of burrs on the half-PTH groove, which need to be scraped off manually; 2. There will be a large number of half-PTH groove copper peeling off, and the product will be scrapped; 3. For products containing half-PTH groove, ...

Method used

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  • Processing method for printing circuit board semi-PTH groove

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Embodiment

[0015] Embodiment, with reference to accompanying drawing, a kind of processing method of printed wiring board half PTH groove is characterized in that taking the following steps:

[0016] a. Determine the position of the half PTH slot on the circuit board 7, and design a cutting line 6 at the end of the half slot according to the size of the half PTH slot on the board, and form a slot by continuous drilling with a drill needle or milling with a milling cutter. A slot with width d1;

[0017] b. Copper plating is carried out on the inner wall of the tank, the thickness of the copper layer in the copper plating area 2 is H, H=0.018~0.075mm;

[0018] c. Tin-plate the PTH tank, and coat a layer of tin-plated protective film 3 on the outside of the copper layer in the copper-plated area 2. The thickness of the tin layer is adjusted according to the width of the slot hole and the thickness of copper plating, which is between 0.08 and 0.20mm ;

[0019] d. Find the center O of the P...

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PUM

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Abstract

The invention provides a processing method for printing a circuit board semi-PTH groove. The processing method is characterized in that the processing method comprises the following steps of: a, forming a groove on a circuit board (7) in a continuously drilling mode by adopting a drilling pin or in a milling mode by a milling cutter; b, plating copper to the inner wall of the groove; c, plating a layer of tinning protection film (3) outside the copper layer of a copper plated area (2); d, drilling out a copper cutting hole (4) by a drilling bit with O serving as a center; e, removing a millable area (5) from a cutting line (6) so as to form the semi-PTH groove (1) with the tinning protection film (3); and f, adopting a tin stripping mode to remove the tinning protection film (3) in the semi-PTH groove (1). According to the invention, residual burr defects after routine processing are overcome, a copper skin rolling phenomenon is prevented, the risk of copper skin falling is eliminated, and the product quality is improved.

Description

technical field [0001] The invention belongs to a processing method of a printed circuit board, in particular to a processing method of a half PTH groove of a printed circuit board. Background technique [0002] In the past, when processing the half PTH slot of the printed circuit board, according to the size and position of the PTH slot in the phase circuit board, select the appropriate drill needle or gong cutter to process the NPTH slot at the specified position by drilling or milling. The NPTH tank is copper-plated, and the NPTH tank is converted into a PTH tank. →Using secondary milling to mill the complete PTH slot into half PTH slot. →Scrape off the copper skin burrs on the half-groove end by manual repair. Due to the limitation of the processing method (milling process) during the processing of the half PTH slot of the printed circuit board, there will be quality defects such as PTH copper peeling and curling at the position of the half slot. Burrs will be formed,...

Claims

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Application Information

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IPC IPC(8): H05K3/40
CPCH05K3/40H05K2203/0242
Inventor 陈振东姜曙光陈念
Owner DALIAN CHONGDA CIRCUIT
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