Worktable micro-adjustment mechanism

Abstract

The invention discloses a worktable micro-adjustment mechanism. The worktable micro-adjustment mechanism comprises a rear plate, a connection plate, a conduction block and a front plate, wherein the connection plate and the conduction block are located between the rear plate and the front plate; a magnet base is arranged at the lower part of the rear plate, and an electromagnet is installed on the magnet base; an air bag is arranged in the middle of the rear plate, and an upper plate is arranged at the upper part of the rear plate; a long connection plate groove is formed in the upper part of the connection plate, and a gap is formed in the lower part of the connection plate and corresponds to the installation position of the electromagnet; the connection plate is connected to the upper plate through an upper plate connection spring sheet and is connected to the conduction block through a conduction block connection spring sheet, and the front plate is fixed to the conduction block; front plate and rear plate connection spring sheets are arranged at the end of the rear plate and the end of the front plate respectively. The worktable micro-adjustment mechanism is applied to the grinding field of wafers, components of the mechanism are flexibly connected, a magnetic field is adopted as the master control measure for micro-motion of the components, the air bag serves as the auxiliary control measure, the structure is simple and compact, the layout is reasonable, the micro-adjustment accuracy of the components is high, loss of the wafers is effectively prevented, and the grinding quality of the wafers is improved.

Description

technical field [0001] The invention relates to the technical field of grinding processing, in particular to a workbench fine-tuning mechanism. Background technique [0002] The semiconductor wafer used in the integrated circuit needs to be initially cut and shaped. Due to the limitation of the existing technology, the edge of the cut semiconductor wafer will have uneven defects. In order to improve the quality of the wafer, the surface of the wafer needs to be ground and polished. [0003] When grinding and polishing, a grinding and polishing machine is needed; the grinding disc on the grinding and polishing machine is connected with the wafer by a flexible mechanism, and its contact pressure is adjustable. A common flexible mechanism is controlled by a cylinder, which has the following problems: [0004] (1) Its structure is complex and its control operation is cumbersome; [0005] (2) It controls the movement of parts through air pressure, and the adjustment accuracy i...

AI Technical Summary

Problems solved by technology

[0004] (1) Its structure is complex and its control operation is cumbersome;

[0005] (2) It controls the movement of parts through air pressure, and the adjustment accuracy is low;

[0006] (3) Its structural flexibility is poor, resulting in a higher probability of chip damage

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