Special device for precision bonding of ultra-thin ring slices and its bonding process

Abstract

The invention discloses a special device for precisely bonding a ultrathin ring piece and a bonding process thereof. A vacuum pump is used for vacuumizing; the ultrathin ring piece is absorbed on an end cover; after a surface B of a basal body is glued, the basal body is mounted on a positioning core through an inner hole thereof; then, an ejecting mechanism is used for applying pressure to eject; after the glue layer is compacted and fully infiltrated with the ultrathin ring piece, the ejecting mechanism is loosened, and vacuum is unloaded to obtain a grinding wheel; overflowing glue in the intersecting place of the basal body and the ring piece is removed; then, a vacuum sucker and the ejecting mechanism are renewedly mounted for absorbing vacuum and ejecting again; the vacuum pump is removed after vacuumizing; the device is totally shifted in a curing box for curing the glue layer; the vacuum is removed after curing; the ejecting mechanism is loosened; and the grinding wheel is taken down to finish the whole bonding process. The special device provides a positioning absorbing platform and an axial support for the ultrathin ring piece, assists enhancement of rigidity of the ultrathin ring piece, and improves the capacity of resisting axial stress and pull (side surface pull of the ultrathin ring piece) of the glue layer.

Description

technical field [0001] The invention belongs to the field of grinding wheel manufacture, and in particular relates to a special device for precision bonding of ultra-thin ring pieces and a bonding process thereof. Background technique [0002] In the field of optoelectronic communication, a 3A1 cutting wheel is used for precision machining of some key parts, such as figure 1 shown. This type of grinding wheel consists of two parts, the ultra-thin ring piece 3 and the base body 1. The two parts are fixedly connected by bonding (that is, the adhesive layer 2) to form a whole. The ultra-thin ring piece 3 is suspended from the base body 1. 5mm. The ultra-thin ring piece 3 is a sintered diamond abrasive working layer, which is mainly used for grinding and cutting. The ring width is between 8-10mm and the thickness is below 0.15mm, which is extremely thin and has poor rigidity; Thick (about 4mm), it mainly plays a supporting role and enhances the rigidity of the cutting wheel. ...

AI Technical Summary

Problems solved by technology

This has the following technical difficulties for the production of bonded 3A1 grinding wheels: the abrasive working layer is an ultra-thin ring sheet, and any uneven force is easily deformed; there are uncontrollable factors in the bonding and curing process (these factors are sticking The stubborn problem of the bonding process, which cannot be solved at the current industry level) will just affect the deformation of the ultra-thin annular flake abrasive layer, such as uneven mixing of the adhesive and curing agent, uneven thickness of the adhesive layer, and inconsistent density of the adhesive layer, which will lead to adhesive When curing and shrinking, the shrinkage state of the adhesive layer is inconsistent, and the adhesive adhesive shrinks during curing, which has a certain pulling effect on the abrasive layer of the ultra-thin ring sheet. Since the shrinkage of the adhesive adhesive is not uniform, the adhesive has a strong impact on the abrasive material. The pulling force of the layer is not uniform, and the abrasive layer of the ring sheet is extremely weak and the rigidity is poor, so the shrinkage of the bonding agent can easily cause the deformation of the abrasive layer of the ultra-thin ring sheet; there is no effective means to correct the ultra-thin ring sheet after bonding and curing. sheet deformation

As long as the ultra-thin ring is deformed, the runout value of the grinding wheel is easy to exceed the tolerance, so the above problems restrict the mass production of this type of grinding wheel

Images