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Solder bump having cored structure and production method therefor

A technology of solder bumps and manufacturing methods, which is applied in semiconductor/solid-state device manufacturing, semiconductor devices, electrical components, etc., can solve problems such as poor production capacity, poor electrical conduction, high aspect ratio, etc., and achieve manufacturing processes and low Reduce cost and realize the effect of simplification

Active Publication Date: 2016-05-18
MITSUBISHI MATERIALS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, since the pillars are formed by electroplating and the solder metal is formed, the throughput of the process is poor, and the bumps become flat and the bump height is limited due to the self-weight and surface tension of the solder metal at the time of melting. Compared with the bump diameter, it is impossible to obtain a high aspect ratio, and even if the amount of solder metal placed is increased, there is a problem that it may come into contact with other adjacent solder bumps and cause a short circuit
[0012] In addition, in the technology described in Patent Document 3, the solder paste on the surface of the primary solder bump is reflowed downward to form a bump with a high aspect ratio. Naturally limited by the weight and surface tension of the solder metal, contact with adjacent molten solder metal bumps may cause poor electrical conduction

Method used

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  • Solder bump having cored structure and production method therefor
  • Solder bump having cored structure and production method therefor
  • Solder bump having cored structure and production method therefor

Examples

Experimental program
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Embodiment 1

[0070] Table 1 shows the component compositions of five types of alloy powders as the solder metal used to form the solder bumps in Example 1.

[0071] In addition, the particle size of the alloy powder for solder metal is 2 to 12 μm, and the average particle size is 7 μm.

[0072] In addition, Table 2 shows the types, combinations, and compounding ratios of the powders contained in the core slurries A to M used to form the sintered cores in Example 1, and the types and content ratios of the fluxes.

[0073] In addition, the powder contained in the slurry for cores has a particle diameter of 1 to 5 μm and an average particle diameter of 2.5 μm.

[0074] First, as the first process, such as figure 2 As shown in (a) to (d), openings (opening diameter: 43 μm, opening pitch : 150 μm) and a metal mask 33 with a thickness of 20 μm, the core paste 32 shown in Table 2 (category symbols of the core paste: A to M) was printed and applied to the pad electrode by the squeegee 31 surfa...

Embodiment 2

[0096] As Example 2, using the slurries N to R for cores of the present invention shown in Table 5 in which at least one of the first group powder and the second group powder is an alloy powder, Table 6 was prepared in the same manner as in Example 1. The shown core structure solder bumps 18 to 22 (hereinafter referred to as "bumps 18 to 22 of the present invention").

[0097] In addition, the particle size of the alloy powder for solder metal is 2 to 12 μm, and the average particle size is 7 μm, and the metal powder and alloy powder contained in the core slurry have a particle size of 1 to 5 μm, and the average particle size is 2.5 μm. μm.

[0098] Table 6 shows the bump heights obtained for the bumps 18 to 22 of the present invention.

[0099] [table 5]

[0100]

[0101] [Table 6]

[0102]

[0103] From the results shown in Table 3, Table 4, and Table 6, it can be seen that the bumps 1 to 5 of Comparative Examples were flattened due to their own weight. In contrast...

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Abstract

Provided are a solder bump having a cored structure and a production method therefor. In producing a solder bump, first, a core paste is print-coated in the central portion of the bump and, at a temperature close to a solder metal reflow-processing temperature or lower, the core paste is sintered to form a sintered core, then, the solder metal is coated around the sintered core by way of a printing method, and the solder metal is reflow-processed, thereby obtaining a solder bump having a cored structure, wherein a sintered core extending in the vertical direction is formed inside the solder bump.

Description

technical field [0001] The present invention relates to a solder bump with a core structure and a manufacturing method thereof, in particular to a solder bump with a core structure that realizes the finer pitch of the solder bump for a semiconductor device, and a pad electrode for a semiconductor device A method of manufacturing a solder bump with a cored structure formed thereon. [0002] This application claims priority based on Patent Application No. 2013-270852 for which it applied in Japan on December 27, 2013, and uses the content here. Background technique [0003] In recent years, for high-density mounting of semiconductors, solder bumps are generally used for bonding, but in order to achieve further high density, finer-pitch formation of solder bumps is required. [0004] And, in order to respond to this demand, several proposals have been made conventionally regarding solder bumps for achieving finer pitches or their manufacturing methods. [0005] For example, P...

Claims

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Application Information

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IPC IPC(8): H01L21/60
CPCH01L24/11H01L24/13H01L2224/05567H01L2224/11332H01L2224/1147H01L2224/11505H01L2224/11849H01L2224/11903H01L2224/13076H01L2224/13109H01L2224/13111H01L2224/13113H01L2224/13139H01L2224/13144H01L2224/13155H01L2224/13157H01L2224/1316H01L2224/13164H01L2224/13166H01L2224/13169H01L2924/00014H01L2924/014
Inventor 中川将石川雅之八十岛司
Owner MITSUBISHI MATERIALS CORP
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