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Improved light emitting diode (LED) package structure

A technology of LED packaging and sealing sleeves, applied in electrical components, circuits, semiconductor devices, etc., can solve problems such as poor waterproof performance and sealing performance, user loss, luminous efficiency, low power consumption, low response speed, etc., to extend service life. , Prevent damage and scrap, and the effect of LED package structure is simple

Inactive Publication Date: 2016-05-25
金思思
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Problems solved by technology

[0002] Light-emitting diode is a solid-state semiconductor device that can directly convert electrical energy into light energy. It has the advantages of high luminous efficiency, low power consumption, fast response, and small size. With the development of technology, LED technology is becoming more and more widely It is widely used in people's daily life, such as various LED lamps and LED displays, etc. In outdoor lighting and backlight LED applications, good waterproof performance and sealing performance are one of the important performances of LEDs, but the existing outdoor Good waterproof performance and poor sealing performance in lighting and backlight LED applications, which will bring certain losses to users

Method used

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  • Improved light emitting diode (LED) package structure

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Embodiment Construction

[0019] like figure 1 As shown, the improved LED packaging structure of the present invention includes a transparent plate 1, an upper case 2 located outside the transparent plate 1, a lower case 3 located below the upper case 2, a light emitting device 4 located inside, and a The conductive rod 5 below the light emitting device 4 and the fixing device 6 arranged inside the lower casing 3 .

[0020] like figure 1 As shown, the transparent plate 1 is a cylinder, the transparent plate 1 is placed horizontally, the transparent plate 1 is made of transparent material, and the transparent plate 1 is provided with a reflection bucket 11 located below, and the reflection bucket 11 is hemispherical, and the inner surface of the reflective bucket 11 is provided with a reflective layer, which can reflect light.

[0021] like figure 1 As shown, the upper casing 2 is ring-shaped, the outer surface of the reflection bucket 11 is fixedly connected with the inner surface of the upper casin...

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Abstract

An improved light emitting diode (LED) package structure comprises a transparent plate (1), an upper shell (2), a lower shell (3), a light emitting device (4), a conductive rod (5) and a fixing device (6), wherein a reflection hopper (11) is arranged on the transparent plate (1), a first fixing block (21) is arranged on the upper shell (2), a second fixing block (31), a baffle plate (32) and a sealing plate (33) are arranged on the lower shell (3), the light emitting device (4) comprises a first reflection ring (41), a second reflection ring (42), a support ring (43), a circuit board (45) and an LED chip (44), a first sealing sleeve (51) and a second sealing sleeve (52) are arranged on the conductive rod (5), and the fixing device (6) comprises a first cross rod (61), a first support (62), a second cross rod (63), a first vertical rod (64), a third sealing sleeve (65) and a second vertical rod (66). The improved LED package structure provided by the invention can exert a relatively high sealing performance on an internal component and has good waterproof effect.

Description

technical field [0001] The invention relates to the technical field of LEDs, in particular to an improved LED packaging structure. Background technique [0002] Light-emitting diode is a solid-state semiconductor device that can directly convert electrical energy into light energy. It has the advantages of high luminous efficiency, low power consumption, fast response, and small size. With the development of technology, LED technology is becoming more and more widely It is widely used in people's daily life, such as various LED lamps and LED displays, etc. In outdoor lighting and backlight LED applications, good waterproof performance and sealing performance are one of the important performances of LEDs, but the existing outdoor Good waterproof performance and poor sealing performance in lighting and backlight LED applications will bring certain losses to users. [0003] Therefore, it is necessary to provide a new technical solution to solve the above technical problems. ...

Claims

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Application Information

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IPC IPC(8): H01L33/48H01L33/60H01L33/52
CPCH01L33/48H01L33/52H01L33/60
Inventor 金思思
Owner 金思思
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