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Polishing and impurity removal mechanism for BGA solder balls

A solder ball and polishing mechanism technology, which is applied in the direction of grinding racks, machine tools suitable for grinding the edge of workpieces, grinding machines, etc., can solve problems such as mist and wrinkles on the surface of solder balls, achieve removal of debris and impurities, and improve Effect of Surface Roughness

Active Publication Date: 2016-06-22
徐州宏巨机械制造有限公司
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  • Abstract
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  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to solve the problems existing in the prior art, to provide a method that can effectively solve the surface quality problems such as mist and wrinkles on the surface of solder balls, effectively improve the surface roughness of solder balls, and effectively remove the Grinding and removing mechanism for BGA solder balls with debris and impurities

Method used

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  • Polishing and impurity removal mechanism for BGA solder balls
  • Polishing and impurity removal mechanism for BGA solder balls
  • Polishing and impurity removal mechanism for BGA solder balls

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Embodiment Construction

[0023] The specific implementation manners of the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. The following examples are used to illustrate the present invention, but are not intended to limit the scope of the present invention.

[0024] see figure 1 A mechanism for grinding and removing impurities of BGA solder balls according to the present invention includes a frame 10, the frame includes a base 11 and a beam 12 above the base, and a carrier plate is movable on the base 11 20. A pair of parallel linear guide rails 30 are formed on the upper end surface of the base 11, the carrier plate 20 is arranged on the linear guide rails 30, and the linear guide rails are elongated guide grooves 30 formed on the upper end surface of the base 11, A pair of guide blocks 21 cooperating with the guide groove 30 are formed on the bottom surface of the carrier plate 20. The guide block 21 is inserted in the guide...

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Abstract

The invention discloses a polishing and impurity removal mechanism for BGA solder balls. The polishing and impurity removal mechanism comprises a rack. The rack comprises a base and a beam located above the base. A carrier plate is movably arranged on the base and provided with a first polishing mechanism. A drive mechanism is arranged on the portion, on one side of the first polishing mechanism, of the carrier plate. A second polishing mechanism is arranged above the first polishing mechanism. An impurity removal mechanism is connected to the second polishing mechanism and mounted on a lifting air cylinder. The lifting air cylinder is mounted on the beam. The impurity removal mechanism comprises dust suction pipes fixedly connected to the top ends of second polishing pieces. The dust suction pipes are connected with a suction fan. By means of the polishing and impurity removal mechanism, the surface quality problems of the vaporific or wrinkled surfaces of the solder balls and the like can be solved effectively, the surface roughness of the solder balls is lowered effectively, and chippings and impurities generated in the polishing process can be removed effectively.

Description

Technical field: [0001] The invention relates to the technical field of BGA solder ball processing equipment, in particular to a mechanism for grinding and removing impurities of BGA solder balls. Background technique: [0002] BGA solder balls are an important part of BGA soldering. Automatic BGA solder ball feeding mainly includes cutting and remelting molding methods and spray molding methods. The former is to cut solder wires of different diameters into units of consistent quality, and then process them in glycerin. Melting into balls; the latter is to melt the solder in a specific container (crucible), then inflate the crucible, increase the pressure to make the melted solder eject from a specific small hole at the bottom of the crucible, and then use high-frequency oscillation Make it into a ball. Regardless of whether the solder balls formed by the cutting and remelting molding method or the spray molding method have surface quality problems such as uneven surface an...

Claims

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Application Information

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IPC IPC(8): B24B27/00B24B9/04B24B55/06B24B41/02B24B47/08
CPCB24B9/04B24B27/0076B24B41/02B24B47/08B24B55/06
Inventor 叶伟然
Owner 徐州宏巨机械制造有限公司
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