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A method for attaching a curved touch panel to a flexible circuit board

A technology of flexible circuit boards and touch panels, applied in the direction of electrical digital data processing, input/output process of data processing, instruments, etc., can solve the problem that flexible circuit boards are not suitable for curved touch panels, etc., and achieve precise bonding , to avoid the effect of size offset

Active Publication Date: 2017-03-22
TPK ADVANCED SOLUTIONS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] The purpose of the present invention is to solve the problem that the existing bonding method of the flexible circuit board is not suitable for the curved touch panel, and to provide a method for bonding the curved touch panel and the flexible circuit board. After bending and forming, it is laminated to the curved touch panel

Method used

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  • A method for attaching a curved touch panel to a flexible circuit board
  • A method for attaching a curved touch panel to a flexible circuit board
  • A method for attaching a curved touch panel to a flexible circuit board

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Embodiment Construction

[0068]The technical solution of the present invention will be described in detail below in conjunction with the accompanying drawings and specific examples, so as to further understand the purpose, solution and effect of the present invention, but it is not intended to limit the scope of protection of the appended claims of the present invention.

[0069] The curved touch panel in the bonding method of the curved touch panel and the flexible circuit board of the present invention is, for example, a 2.5D or 3D touch panel. like image 3 As shown, the curved touch panel 400 is 2.5D. The touch panel 400 includes a cover. The side of the cover is curved relative to the main surface, so the side of the cover and the main surface form a groove on the cover. The touch sensing unit (not shown) of the curved touch panel 400 is usually located on one side of the groove of the cover plate, for example, it can be directly formed on the surface of the groove, and the corresponding bonding ...

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PUM

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Abstract

The invention discloses a joint method of a curved touch panel and a flexible printed circuit board. The method comprises following steps of S10, placing conductive adhesive in the joint area of the curved touch panel; S20, bending the flexible printed circuit board, wherein the bended flexible printed circuit board has a joint area and a non-joint area; S40, laminating the joint area of the bended flexible printed circuit board and the joint area of the curved touch panel, wherein the connection mat of the joint area of the bended flexible printed circuit board and the joint mat of the curved touch panel are communicated through the conductive adhesive. Through adoption of the joint method provided by the invention, the flexible printed circuit board is prevented from generating size offset in the joint process; and the flexible printed circuit board and the curved touch panel are jointed effectively.

Description

technical field [0001] The invention relates to a method for laminating a touch panel and a flexible circuit board, in particular to a method for laminating a flexible circuit board to a curved touch panel after being bent and formed. Background technique [0002] In recent years, electronic devices with touch input functions such as mobile phones, car navigation systems, portable computers, and computers have been widely used, and these products are usually equipped with touch panels. The touch panel in the prior art can be resistive, capacitive, infrared induction, electromagnetic induction, sound wave induction and so on. [0003] For example, if figure 1 As shown, the capacitive touch panel 1 can be defined with a touch area 100V and a peripheral area 100B located on at least one side of the touch area, and a plurality of touch sensing units 10 can be arranged in the touch area 100V, and the A plurality of first bonding pads 11 and a plurality of second bonding pads 12...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G06F3/041
CPCG06F3/041
Inventor 王志胜林惠燕王雅萍
Owner TPK ADVANCED SOLUTIONS