Method for manufacturing LTCC (Low Temperature Co-Fired Ceramic) multilayer wiring curved surface substrate
A technology of multi-layer wiring and manufacturing method, applied in the direction of semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve the problem of difficult to achieve curved LTCC substrate structure manufacturing, and achieve the effect of ensuring interconnect integrity and accuracy.
Active Publication Date: 2016-06-22
NO 54 INST OF CHINA ELECTRONICS SCI & TECH GRP
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Problems solved by technology
However, within the LTCC substrate system, it is difficult to realize the fabrication of curved LTCC substrate structures using conventional LTCC substrate fabrication techniques.
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[0018] Combine below figure 1 The implementation examples of the present invention are further described.
[0019] The number of LTCC ceramic layers of the curved substrate in the example is 15 layers. The material used is 8-inch Ferro-A6M or DuPont951Pt.
[0020] A method for manufacturing a LTCC multilayer wiring curved substrate, the LTCC multilayer wiring curved substrate is composed of a multilayer LTCC substrate 1, and metallized wiring and interlayer signal vias 2 are arranged on the LTCC substrate. It is characterized in that it comprises the following steps:
[0021] (1) According to the design curvature of the curved substrate, the metallized wiring and interlayer signal vias designed based on the planar LTCC substrate are corrected to ensure the effective connection of the metallized wiring and interlayer signal vias after the curved surface treatment;
[0022] According to the design curvature, the thickness of LTCC green ceramic sheet and the number of product ...
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The invention discloses a method for manufacturing an LTCC (Low Temperature Co-Fired Ceramic) multilayer wiring curved surface substrate, and belongs to the manufacturing field of advanced circuit integrated substrates. The production of the LTCC curved surface substrate mainly comprises three main parts, namely, multilayer LTCC substrate lamination, metal wiring and formation of inter-layer signal through holes. However, the structure of the curved surface LTCC substrate is difficult to manufactureby the manufacturing technology of conventional LTCC substrates. The method disclosed by the invention has the advantages that before the curved surface substrate is manufactured, the pattern of each layer of LTCC is corrected to fully guarantee the interconnection integrity of inter-layer signal connection at the cross section of a curved surface; and a bearing plate, a stacking plate and a setter plate with target curved surface interfaces are imported in printing, stacking, laminating and sintering stages to serve as necessary auxiliary supporting and protecting devices, thereby not only guaranteeing the manufacturing precision of the curved surface structure, but also providing sufficient support and protection in a curved surface formation process of a ceramic chip. Due to the realization of the LTCC curved surface substrate, the application of the LTCC substrate is expanded to the field of structure and function integration and attached circuit design.
Description
technical field [0001] The invention belongs to the field of advanced integrated substrate manufacturing, in particular to a method for manufacturing a curved substrate with multilayer wiring on a low-temperature co-fired ceramic (LTCC) substrate. technical background [0002] Low temperature co-fired ceramic (LTCC) technology is a passive component integrated circuit technology developed in the 1980s. The LTCC substrate supports multi-layer wiring, and can integrate some passive components into the substrate, making it have the advantages of high speed, high frequency, high density, high reliability, etc., which is conducive to system miniaturization, and improves the system while increasing the circuit assembly density. Reliability, so it is widely used in microwave communication, aerospace and military electronics and other fields. [0003] In recent years, in addition to its wide application in the field of electronic technology, LTCC technology has gradually been appli...
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CPCH01L21/48
Inventor 卢会湘严英占唐小平党元兰赵飞李攀峰
Owner NO 54 INST OF CHINA ELECTRONICS SCI & TECH GRP