A kind of manufacturing method for ltcc multilayer wiring curved surface substrate
A multi-layer wiring and manufacturing method technology, applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve problems such as difficult to realize curved surface LTCC substrate structure manufacturing, and achieve the effect of ensuring interconnection integrity and accuracy
Active Publication Date: 2018-06-29
NO 54 INST OF CHINA ELECTRONICS SCI & TECH GRP
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Problems solved by technology
However, within the LTCC substrate system, it is difficult to realize the fabrication of curved LTCC substrate structures using conventional LTCC substrate fabrication techniques.
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[0018] Combine below figure 1 The implementation examples of the present invention are further described.
[0019] The number of LTCC ceramic layers of the curved substrate in the example is 15 layers. The materials used are 8-inch Ferro-A6M or DuPont 951Pt.
[0020] A method for manufacturing a LTCC multilayer wiring curved substrate, the LTCC multilayer wiring curved substrate is composed of a multilayer LTCC substrate 1, and metallized wiring and interlayer signal vias 2 are arranged on the LTCC substrate. It is characterized in that it comprises the following steps:
[0021] (1) According to the design curvature of the curved substrate, the metallized wiring and interlayer signal vias designed based on the planar LTCC substrate are corrected to ensure the effective connection of the metallized wiring and interlayer signal vias after the curved surface treatment;
[0022] According to the design curvature, the thickness of LTCC green ceramic sheet and the number of produ...
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The invention discloses a manufacturing method for an LTCC multilayer wiring curved substrate, which belongs to the field of advanced circuit integrated substrate manufacturing. The LTCC curved substrate mainly includes three main parts: multi-layer LTCC substrate stacking, metallized wiring and interlayer signal vias. However, it is difficult to realize the fabrication of curved LTCC substrate structures by applying conventional LTCC substrate fabrication techniques. The advantages of the present invention are: before the curved substrate is manufactured, the pattern of each layer of LTCC is corrected, which fully ensures the interconnection integrity of the interlayer signal connection at the curved surface section; The introduction of the bearing plate, lamination plate and setter plate with the target curved surface interface as the necessary auxiliary support and protection device not only fully guarantees the precision in the manufacture of the curved surface structure, but also gives sufficient support and Protect. The realization of the LTCC curved substrate expands the application of the LTCC substrate to the field of structure and function integration and attached circuit design.
Description
technical field [0001] The invention belongs to the field of advanced integrated substrate manufacturing, in particular to a method for manufacturing a curved substrate with multilayer wiring on a low-temperature co-fired ceramic (LTCC) substrate. technical background [0002] Low temperature co-fired ceramic (LTCC) technology is a passive component integrated circuit technology developed in the 1980s. The LTCC substrate supports multi-layer wiring, and can integrate some passive components into the substrate, making it have the advantages of high speed, high frequency, high density, high reliability, etc., which is conducive to system miniaturization, and improves the system while increasing the circuit assembly density. Reliability, so it is widely used in microwave communication, aerospace and military electronics and other fields. [0003] In recent years, in addition to its wide application in the field of electronic technology, LTCC technology has gradually been appli...
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IPC IPC(8): H01L21/48
CPCH01L21/48
Inventor 卢会湘严英占唐小平党元兰赵飞李攀峰
Owner NO 54 INST OF CHINA ELECTRONICS SCI & TECH GRP