Mechanical arm and inspection system

Abstract

The invention relates to a mechanical arm and an inspection system. The mechanical arm comprises a fixed pulley, a first pulley and a second pulley, and a first pair and a second pair of upper cable wires and lower cable wires, wherein the fixed pulley is driven by a motor; the first pulley and the second pulley are respectively provided with a first processing device and a second processing device; the two pairs of cable wires are formed by materials which do not generate particles in the case of operation; two ends of the first pair of upper cable wire and lower cable wire are respectively fixed on the first pulley and the fixed pulley; and two ends of the second pair of upper cable wire and lower cable wire are respectively fixed on the second pulley and the fixed pulley. The invention discloses a process of exchanging two samples by using the mechanical arm, no movement clearance exists, no friction exists and no particle pollution exists. By using the unique structure and the materials for the cable wires, the mechanical arm has a long operation service life.

Description

technical field [0001] The present invention relates to the field of a semiconductor inspection system, and more particularly, to a technique of exchanging two samples using a robot arm. Background technique [0002] Moore's Law states that the number of transistors on an integrated circuit doubles every two years, which leads to higher transistor densities, proportionally higher costs and higher performance per watt. The reduction in node size is an essential reason for Moore's Law. As shrinking dimensions become tens of nanometers, defects on samples must be controlled within a certain range in order to guarantee the functionality and yield of the fabricated chips. [0003] With increasingly stringent design constraints and the need to increase yield and reduce semiconductor manufacturing costs, defect inspection in semiconductor processing to detect and classify hybrids is more important than ever. Defect inspection becomes more difficult as defect sizes become smaller ...

AI Technical Summary

Problems solved by technology

When performing defect inspection, it is necessary to introduce as few particles as possible, otherwise defect analysis will be affected and chip yield reduction may occur

Particles may be generated when exchanging inspected and uninspected wafers in existing electron beam inspection systems

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