Reversed-polarity AlGaInP-based LED coated with ITO on surface and manufacturing method thereof
A surface covering and manufacturing method technology, applied in the direction of electrical components, circuits, semiconductor devices, etc., can solve the problems of affecting the electrical contact between indium tin oxide and n-type semiconductor layers, damaging the MQW active layer, and difficulty in epitaxial growth, etc., to achieve improved The uniformity of current expansion, the improvement of light extraction efficiency, and the effect of eliminating light absorption
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[0035] One, such as figure 1 and 2 Shown is the structural representation of the preferred example of the present invention in the manufacturing process, and the manufacturing steps are as follows:
[0036] 1. If figure 1 As shown, an epitaxial layer is grown on a GaAs temporary substrate 101 by MOCVD equipment, and the epitaxial layer includes a GaAs buffer layer 102, a GaInP cut-off layer 103, an n-GaAs ohmic contact layer 104, an n-AlGaInP confinement layer 105, and an MQW multi-quantum well. Source layer 106 , p-AlGaInP confinement layer 107 , p-GaP window layer 108 .
[0037] Wherein the n-GaAs ohmic contact layer 104 preferably has a thickness of 20nm to 100nm, and a doping concentration of 1×10 19 cm -3 Above, the doping element is Si, so as to form a good ohmic contact with the ohmic contact point 204 .
[0038] The preferred thickness of the p-GaP window layer 108 is 600nm to 8000nm, and the doping concentration is 1×10 18 cm -3 Above, the doping element is Mg ...
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