Server cabinet with liquid cooling system

A technology for server cabinets and servers, applied in cooling/ventilation/heating renovation, electrical components, electrical equipment structural parts, etc., which can solve the problems of pipeline layout, rack design, equipment maintenance and installation difficulties, many pipeline interfaces, and leakage risks. big problem

Active Publication Date: 2018-09-28
GUANGDONG SHENLING ENVIRONMENT SYST CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The liquid cooling system of general equipment is closely coupled with the rack and equipment, which brings many difficulties to pipeline layout, rack design, equipment wiring, equipment maintenance and installation
Moreover, the cold plate is generally placed directly on each main heat source, and the coolant flows through the cold plate to take away the heat of the heat source. There are many pipe connections, and the risk of leakage is high.

Method used

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  • Server cabinet with liquid cooling system
  • Server cabinet with liquid cooling system
  • Server cabinet with liquid cooling system

Examples

Experimental program
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Effect test

Embodiment Construction

[0027] Such as Figures 1 to 6 As shown, a server cabinet with a liquid cooling system includes a cabinet body 10, a liquid cooling distribution unit 20, and a heat pipe heat conduction unit 30. The liquid cooling distribution unit 20 includes a liquid inlet pipe 210, a liquid outlet pipe 220, a liquid supply pipe Pipe 230 and liquid return pipe 240, the heat pipe heat conduction unit 30, the heat pipe heat conduction unit 30 includes a liquid cooling module 310, a heat pipe 320, a heat absorption module 330, one end of the liquid supply pipe 230 and the liquid inlet pipe 210 The other end of the liquid supply pipe 230 is connected to the liquid inlet of the liquid cooling module 310, one end of the liquid return pipe 240 is connected to the liquid outlet pipe 220, and the other end of the liquid return pipe 240 It is connected to the liquid outlet of the liquid cooling module 310, one end of the heat pipe 320 is connected to the liquid cooling module 310, and the other end of...

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PUM

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Abstract

The invention relates to a server cabinet with a liquid cooling system. The server cabinet comprises a cabinet body, a liquid cooling distribution unit and a heat pipe heat-conducting unit, wherein the liquid cooling distribution unit comprises a liquid inlet pipe, a liquid outlet pipe, a liquid supply pipe and a liquid return pipe; the heat pipe heat-conducting unit comprises a liquid cooling module, a heat pipe and a heat-absorbing module; one end of the liquid supply pipe is connected with the liquid inlet pipe; the other end of the liquid supply pipe is connected with a liquid inlet of the liquid cooling module; one end of the liquid return pipe is connected with the liquid outlet pipe; the other end of the liquid return pipe is connected with a liquid outlet of the liquid cooling module; one end of the liquid return pipe is connected with the liquid outlet pipe; the other end of the liquid return pipe is connected with the liquid outlet of the liquid cooling module; one end of the heat pipe is connected with the liquid cooling module; the other end of the heat pipe is connected with the heat absorbing module; and the heat absorbing module is in contact with a server heat source of the cabinet body. Due to application of the heat pipe, a cooling liquid is prevented from entering a server; the risk that the server is damaged due to leakage of the cooling liquid is reduced; the server cabinet is simple in layout, and convenient to maintain and install; and the server can be flexibly added and reduced.

Description

technical field [0001] The invention relates to the technical field of heat dissipation of server cabinets, in particular to a server cabinet with a liquid cooling system. Background technique [0002] With the rapid development of information technology, the data center is also constantly changing: the performance of equipment is rapidly improved, the power density is significantly increased, the application of high-performance rack box servers, blade servers and storage devices is becoming more and more common, and virtualization technology are increasingly used to consolidate servers and storage. This change directly causes the heat dissipation of the data center to increase from the original several kilowatts to hundreds of kilowatts, and the power density of the data center computer room continues to increase, which poses a challenge to the cooling system of the data center computer room. [0003] The traditional heat dissipation method of the data center computer room...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K7/20
CPCH05K7/20781
Inventor 陈前廖润球谢春辉顾剑彬周圆圆
Owner GUANGDONG SHENLING ENVIRONMENT SYST CO LTD
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