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Transfer chambers with an increased number of sides, semiconductor device manufacturing processing tools, and processing methods

A technology for processing tools and transfer chambers, used in semiconductor/solid-state device manufacturing, conveyor items, transportation and packaging, etc., which can solve problems such as substrate exposure to non-ideal

Active Publication Date: 2016-06-22
APPLIED MATERIALS INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Either can expose the substrate to undesirable environments (e.g., oxidizing species) and / or other contaminants

Method used

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  • Transfer chambers with an increased number of sides, semiconductor device manufacturing processing tools, and processing methods
  • Transfer chambers with an increased number of sides, semiconductor device manufacturing processing tools, and processing methods
  • Transfer chambers with an increased number of sides, semiconductor device manufacturing processing tools, and processing methods

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Embodiment Construction

[0025] Reference will now be made in detail to exemplary embodiments of the present disclosure, which are illustrated in the accompanying drawings. The features of the various embodiments described herein are combinable with each other unless specifically stated otherwise.

[0026] According to an embodiment of the present invention, there is provided a semiconductor device manufacturing platform, such as a tool and / or mainframe (referred to herein as a "processing tool" or "tool"), the platform includes a transfer chamber, the The transfer chamber includes an increased number of locations (e.g., facets) for attaching or otherwise coupling the processing chamber to a substrate transfer unit (e.g., one or more load lock chambers and also possibly one or more access units). For example, in certain embodiments, at least 7, at least 8, or even 9 or more connection locations may be provided in a transfer chamber within a single tool. Providing additional connection locations can ...

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Abstract

A transfer chamber configured to be used during semiconductor device manufacturing is described. Transfer chamber includes at least one first side of a first width configured to couple to one or more substrate transfer units (e.g., one or more load locks or one or more pass-through units), and at least a second set of sides of a second width that is different than the first width, the second set of sides configured to couple to one or more processing chambers. A total number of sides of the transfer chamber is at least seven. Transfers within the transfer chamber are serviceable by a single robot. Process tools and methods for processing substrates are described, as are numerous other aspects.

Description

[0001] related application [0002] This application claims the benefit of U.S. Provisional Application No. 61 / 899,862 (Attorney Docket No. 21233 / USA) filed on November 4, 2013 and entitled "SEMICONDUCTOR DEVICE MANUFACTURING PLATFORMWITHANINCREASEDNUMBEROFSIDES" / L), which application is hereby incorporated by reference for all purposes. technical field [0003] The present invention relates to semiconductor device manufacturing, and more particularly to the configuration of semiconductor device manufacturing platforms. Background technique [0004] The fabrication of semiconductor devices typically involves performing a series of steps on a substrate or "wafer" such as a silicon substrate, glass plate, and the like. These steps may include polishing, deposition, etching, photolithography, heat treatment, and the like. Often many different processing steps can be performed in a single processing system or "tool" containing multiple processing chambers. However, it is oft...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/677H01L21/02
CPCH01L21/67196H01L21/67201H01L21/67207H01L21/67739H01L21/67742H01L21/67167H01L21/67184
Inventor 迈克尔·罗伯特·赖斯迈克尔·迈尔斯约翰·J·马佐科迪安·C·赫鲁泽克迈克尔·库查尔苏斯汉特·S·科希特潘查拉·N·坎卡纳拉埃里克·A·恩格尔哈特
Owner APPLIED MATERIALS INC