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Method for the surface treatment of a semiconductor substrate

A semiconductor and substrate technology, applied in semiconductor/solid-state device manufacturing, printing, electrical components, etc., can solve problems such as instability

Active Publication Date: 2016-06-29
STMICROELECTRONICS SRL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this type of coating is known to be unstable when exposed to a liquid environment, such as in the case of many water-based inks

Method used

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  • Method for the surface treatment of a semiconductor substrate
  • Method for the surface treatment of a semiconductor substrate
  • Method for the surface treatment of a semiconductor substrate

Examples

Experimental program
Comparison scheme
Effect test

example 1

[0050] Example 1 - Preparation of an anti-wetting coating on a semiconductor material substrate:

[0051] The first step of the process involves fabricating the PDMS support.

[0052] Specifically, a pre-polymerized mixture is prepared, from the matrix 184SILICONEELASTOMERKIT (registered in the name of DowCorningCorporation, Michigan, USA) and cross-linking agent (DowCorning) are composed in a weight percentage of 10:1. Degassing of the mixture was then performed under vacuum for one hour. The mixture thus obtained was deposited on a silicon masterbatch measuring 3 cm x 3 cm. The masterbatch was pre-coated with an organosilane layer for subsequent desorption to the PDMS support. The mixture deposited on the masterbatch was then crosslinked in an oven at 90° C. for one hour, and the PDMS support thus obtained was desorbed from the silicon masterbatch.

[0053] The PDMS support thus obtained was immersed in the 1-hexadecene chain solution for 12 hours under nitrogen flow. ...

example 2

[0059] Example 2 - Properties of the anti-wetting substrate according to Example 1

[0060] Nozzle panels for inkjet printing provided according to the method described in Example 1 were tested for their anti-wetting capabilities.

[0061] Each of four identical panels (Sample 1-Sample 4) having dimensions 40 mm x 12 mm was introduced into a vial containing a cyan pigment with a pH between 7 and 9 and a water-based ink.

[0062] Dip two-thirds of the surface of each panel into the ink. The vial was then closed to prevent ink evaporation and set at a temperature of 60°C for 7 days.

[0063] Next, the panel was removed from the vial and cleaned with demineralized water followed by 2-propanol. The panels are then dried.

[0064] The wetting resistance of the panels thus obtained was evaluated by measuring the contact angle of water droplets deposited thereon. In particular, the contact angle values ​​on the panel before applying the anti-wetting layer according to the describ...

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PUM

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Abstract

The invention relates to a method for the surface treatment of a semiconductor substrate. A method for application of an anti-wetting coating to a substrate of a semiconductor material is described. The method includes applying to a support a solution of a hydrocarbon comprising at least one unsaturated bond and, optionally, at least one hetero-atom for obtaining a layer of hydrocarbons. The method also includes treating at least one surface of the substrate of the semiconductor material with an acid. The layer of hydrocarbons is transferred from the support to the surface of the substrate of the semiconductor material. The layer of hydrocarbons is chemically coupled with the surface of the substrate of the semiconductor material. The method may be applied to an integrated ink jet print head provided with a nozzle plate in which the nozzle plate serves as the substrate of the semiconductor material.

Description

[0001] Prior Applications and Cross-References [0002] This application claims priority to Italian Patent Application No. TO2014A001089 filed December 22, 2014, the content of which is incorporated by reference in its entirety into this application to the fullest extent permitted by law. technical field [0003] The present invention relates to a method for the surface treatment of semiconductor material substrates, in particular nozzle panels for inkjet printers, and more particularly, to a method for applying a chemically stable and confined to the nozzle surface. Method of wet coating. Background technique [0004] In various applications, it is necessary to apply water- and / or oil-repellent coatings to surfaces exposed to liquids. For example, in the case of inkjet printheads, it is necessary to apply an anti-wetting coating (AWC) on the printhead nozzle faceplate to prevent ink from forming residues during or after inkjet printing. In fact, residual buildup around t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B41J2/16B41J2/14
CPCB41J2/1433B41J2/1629B41J2/1606B41J2/164B41J2/162H01L21/02115H01L21/30604H01L21/0206H01L21/02288
Inventor V·迪帕尔玛F·波罗
Owner STMICROELECTRONICS SRL