Air-cooled heat dissipation control method for semiconductor refrigeration equipment
A technology of refrigeration equipment and control methods, which is applied in the direction of refrigerators, refrigeration components, refrigeration and liquefaction, etc., can solve the problems of semiconductor refrigeration module damage, hot end temperature rise, unfavorable power saving, etc., to improve service life, reduce noise, The effect of avoiding excessive negative effects
Active Publication Date: 2018-08-07
QINGDAO HAIER SPECIAL ICEBOX
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However, it is only necessary to use a low-power power supply to ensure the normal operation of the fan, and still using a high-power power supply for power supply will lead to increased energy consumption, which is not conducive to saving electric energy
[0005] In addition, in the existing semiconductor refrigeration equipment, when the voltage across the semiconductor refrigeration module of the semiconductor refrigeration equipment is too high, the heat dissipation of the hot end of the semiconductor refrigeration module is not good, etc., the temperature of the hot end of the semiconductor refrigeration module tends to rise rapidly, and eventually Causes damage to the semiconductor refrigeration module
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[0056] The specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings.
[0057] Since the existing equipment that uses semiconductor refrigeration usually uses fans to cool the hot end of the semiconductor refrigeration module, it needs to consume a lot of power and the fan has always been working with serious noise, such as Figure 1-4 , The hot-end heat sink 400 in this embodiment includes a second heat conductor 41, a plurality of second heat pipes 42 and a heat sink group 43, the second heat pipe 42 is connected to the second heat conductor 41, and the heat dissipation The chip group 43 is connected to the second heat pipe 42. Specifically, the second heat conductor 41 is attached to the hot end of the semiconductor refrigeration module, and the heat sink group 43 is attached to the housing 101. The heat generated by the hot end of the semiconductor refrigeration module is transferred to the second heat pipe 42 ...
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The invention discloses an air-cooled heat dissipation control method for semiconductor refrigeration equipment. Due to the design of the air-cooled heat dissipation device of the semiconductor refrigeration equipment, the heat dissipation effect of the heat dissipation module in a natural windless state is greatly improved. Therefore, the method of the invention can Improve the limit conditions for fan startup, only when the power supply voltage U>set value, control the fan to start, and adjust the fan speed according to the temperature difference △T, when the power supply voltage U<set value, control the fan to stop running, the fan is not It is in the running state in real time. Therefore, while ensuring heat dissipation, the noise generated by the fan rotation is reduced, the service life of the fan is improved, and the energy consumption is reduced.
Description
Technical field [0001] The invention belongs to the technical field of heat dissipation of refrigeration equipment, in particular to an air-cooled heat dissipation control method for semiconductor refrigeration equipment. Background technique [0002] Semiconductor refrigeration equipment generally includes semiconductor refrigeration modules, cold-end radiators and hot-end radiators. The cold end of the semiconductor refrigeration module cools the equipment compartment through the cold end radiator, the hot end heats, and the hot end radiator dissipates the heat from the hot end. [0003] The existing semiconductor refrigeration system uses a constant pressure method to drive the fan, so that the fan speed is constant. However, the constant rotation speed will wear a lot to the fan, which makes the life of the fan short and the working noise is loud. Furthermore, since the temperature of the semiconductor refrigeration module is not constant, when the temperature of the semicond...
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IPC IPC(8): F25B49/00
Inventor 肖长亮刘越刘华芦小飞杨末张进肖曦孙科
Owner QINGDAO HAIER SPECIAL ICEBOX