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Thermally conductive silicone composition, cured product, and composite sheet

A composite sheet, thermal conductivity technology, used in electronic equipment, transportation and packaging, chemical instruments and methods, etc.

Active Publication Date: 2020-10-23
SHIN ETSU CHEM IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0006] It should be noted that JP-A-2014-145024 is cited as a prior art related to the present invention, which claims heat resistance (250°C), but there is a need to add a heat stabilizer and it is limited to a low-oxygen heating environment. question

Method used

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  • Thermally conductive silicone composition, cured product, and composite sheet
  • Thermally conductive silicone composition, cured product, and composite sheet
  • Thermally conductive silicone composition, cured product, and composite sheet

Examples

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Embodiment

[0089] Examples and comparative examples are shown below to describe the present invention in detail, but the present invention is not limited by the following examples.

[0090] [the preparation of the composition]

[0091](A) Component: Dimethicone represented by the following formula (1)

[0092] 【Chemical 2】

[0093]

[0094] (X is an organic functional group, and n is a number giving the viscosity described below.)

[0095] (A-1) X = methyl group, kinematic viscosity 10,000mm 2 / s(25℃)

[0096] (A-2) X = methyl group, kinematic viscosity 30,000mm 2 / s(25℃)

[0097] (B) Component: Alumina having an average particle diameter as follows

[0098] (B-1) Fragmented α-alumina with an α-alumina rate of 99% and an average particle size of 5 μm

[0099] (B-2) Fragmented α-alumina with an α-alumina rate of 95% and an average particle size of 10 μm

[0100] (B-3) Spherical α-alumina with an α-alumina rate of 92% and an average particle size of 20 μm

[0101] (B-4) Crushed...

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Abstract

Provided is a thermoconductive silicone composition which contains over 90% of alpha alumina alumina of which [alpha] rate is greater than or equal to 90%, with respect to the total parts by weight of a thermoconductive filler, and shows the weight reduction rate less than 1% when exposed to air under a condition involving a temperature of 250 DEG C for six hours. According to the present invention, the thermoconductive silicone composition using over 90% of alpha alumina of which [alpha] rate is greater than or equal to 90%, with respect to the total parts by weight of a thermoconductive filler exhibits the low weight reduction rate and excellent heat resistance even at 250 DEG C. Therefore, the thermoconductive silicone composition and a cured product and a composite sheet can be used to cope with a condition requiring heat resistance at approximately 250 DEG C, such as semiconductor devices using silicon carbide-based substrate materials and automobile-mountable heaters for heat radiation.

Description

technical field [0001] The present invention relates to, for example, a thermally conductive silicone composition, a cured thermally conductive silicone, and a thermally conductive silicone composition used for heat dissipation between a heat-generating component and a heat-radiating component in an electronic device, especially when exposed to a high-temperature environment of about 250°C. Non-toxic silicone composite sheet. Background technique [0002] Transistors, diodes, and other semiconductors used in electronic equipment such as inverters and power supplies generate a large amount of heat themselves with the increase in performance, speed, miniaturization, and high integration. The temperature rise of the equipment caused by this heat causes Bad action, destruction. Therefore, a number of heat dissipation methods and heat dissipation members used therefor have been proposed for suppressing temperature rise of semiconductors in operation. For general heat dissipatio...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L83/06C08K3/22B32B17/02B32B17/10B32B27/08B32B27/28B32B27/20
CPCB32B27/08B32B27/12B32B27/20B32B27/281B32B27/283B32B2250/40B32B2262/101B32B2307/302B32B2307/306B32B2307/536B32B2457/00B32B2605/00C08K2201/002C08K2201/014C08L83/06C08L2201/08C08L2203/20C08K2003/2227
Inventor 石原靖久远藤晃洋
Owner SHIN ETSU CHEM IND CO LTD