Semiconductor laser temperature control system based on TEC

A temperature control system, laser technology, applied in temperature control, control/regulation system, non-electric variable control, etc., can solve the problems of no TEC heat dissipation, complex design circuit, expensive chip, etc., to achieve less heat dissipation and low power consumption , The effect of improving power efficiency

Inactive Publication Date: 2016-07-20
HEBEI UNIV OF TECH
View PDF5 Cites 11 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] CN104331102A discloses a kind of " laser temperature control circuit based on TEC ", and this control circuit has used NTC thermistor to measure temperature signal as temperature sensor, uses the MAX1978 special-purpose temperature control chip of MAXIM company, but this chip is expensive, and NTC The design circuit is complex, and the temperature error of the measurement result is relatively large. In addition, the patent does not dissipate heat from the hot end of the TEC in time, making the temperature control effect poor.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Semiconductor laser temperature control system based on TEC
  • Semiconductor laser temperature control system based on TEC
  • Semiconductor laser temperature control system based on TEC

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0021] The present invention will be further described below in conjunction with the embodiments and accompanying drawings, but this should not be used as a limitation to the protection scope of the claims of the present application.

[0022] The present invention is based on TEC semiconductor laser temperature control system (abbreviation temperature control system, see Figure 1-6 ) includes a temperature sensor 1, a single-chip microcomputer 2, a TEC digital PWM power drive circuit 3 and a TEC cooling assembly 4, and the TEC cooling assembly 4 (see Figure 5 ) including TEC44, refrigeration block 41, heat dissipation aluminum plate 42 and exhaust fan 43, the cold surface and hot surface of TEC44 are evenly coated with thermal conductive silicone grease, the cold surface of TEC44 is close to refrigeration block 41, and the hot surface of TEC44 is close to heat dissipation aluminum plate 42, There is an exhaust fan 43 directly under the heat dissipation aluminum plate 42, and...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention relates to a semiconductor laser temperature control system based on TEC. It is characterized in that the temperature control system comprises a temperature sensor, a one-chip microcomputer, a TEC digital PWM power drive circuit and a TEC heat dissipation module. The TEC heat dissipation module comprises a TEC, a refrigeration block, a heat dissipation aluminum plate and an exhaust fan. The cold surface and the hot surface of the TEC are both coated with heat conducting silicone grease. The cold surface of the TEC is clung to the refrigeration block and the hot surface of the TEC is clung to the heat dissipation aluminum plate. The exhaust fan is arranged under the heat dissipation aluminum plate; one end of the temperature sensor is connected with the semiconductor laser, and the other end is connected with an input-output pin of the one-chip microcomputer; the PID algorithm is stored inside the one-chip microcomputer; the output end of the one-chip microcomputer is connected with one end of the TEC digital PWM power drive circuit; the other end of the TEC digital PWM power drive circuit is connected with a TEC wiring terminal of the TEC heat dissipation module; the circuit structure of the TEC digital PWM power drive circuit is that a base of a triode Q1 is connected with the output end of the one-chip microcomputer; the output end of the one-chip microcomputer is connected with a power supply terminal VCC through a resistor R2.

Description

technical field [0001] The invention relates to the technical field of temperature control, in particular to a semiconductor laser temperature control system based on TEC. Background technique [0002] So far, semiconductor lasers have been developed for more than 50 years. In just a few decades, the performance of semiconductor lasers has been significantly improved in all aspects. As a new type of light source, semiconductor lasers have been more and more widely used in communication, military, medical and other fields because of their small size, light weight, high efficiency, low power drive, and direct modulation. However, the semiconductor laser's output wavelength, threshold current, service life, output power, etc. are all affected by temperature, which limits the use of the laser. Therefore, the temperature control of the semiconductor laser plays a very important role in the application of the laser. [0003] At present, there are two main types of temperature con...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): G05D23/20
CPCG05D23/20G05D23/2034
Inventor 刘新福伏娜孙晶葛帅
Owner HEBEI UNIV OF TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products