Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Light waveguide wafer surface detecting device

A surface inspection and optical waveguide technology, used in semiconductor/solid-state device testing/measurement, semiconductor/solid-state device manufacturing, electrical components, etc., can solve the problem of lack of residual stress and grooves on the wafer surface, and facilitate comprehensive scanning inspection. , The effect of convenient and fast operation, high detection efficiency and high precision

Active Publication Date: 2016-07-20
黄山博蓝特半导体科技有限公司
View PDF8 Cites 12 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] The purpose of the present invention is to provide an optical waveguide wafer surface detection device to solve the problem of lack of special equipment to simultaneously detect the characteristics of wafer surface residual stress and grooves

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Light waveguide wafer surface detecting device
  • Light waveguide wafer surface detecting device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0028] The specific implementation manners of the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. The following examples are used to illustrate the present invention, but are not intended to limit the scope of the present invention.

[0029] Such as figure 1 As shown, the present invention provides an optical waveguide wafer surface detection device, including a multi-directional motion platform 1 capable of moving in multiple directions along a horizontal plane, a laser confocal scanning probe 4 and a fixed bracket 3, the laser confocal scanning probe 4 is set on the fixed bracket 3, the wafer to be inspected 2 is placed on the multi-directional motion platform 1, and the laser confocal scanning probe 4 is located above the wafer to be inspected 2, the multi-directional The motion platform 1 drives the wafer to be inspected 2 to move in multiple directions, so that the laser confocal scanning probe 4 ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to the technical field of wafer surface detection, and discloses a light waveguide wafer surface detecting device which comprises a multi-direction movement platform capable of moving in multiple directions of the horizontal plane, a laser confocal scanning measurement head and a fixed support.Due to the laser confocal scanning measurement head, by directly scanning a to-be-detected wafer, the warp rate and other data can be measured and the residual stress data of the surface of the wafer can be calculated, and ditches and other structural characteristics on the surface of the to-be-detected wafer can be directly obtained through scanning; the residual stress, ditches and other characteristics of the surface of the wafer can be detected at the same time and are prevented from being forwarded to different machines to be detected multiple times, the number of detection times of the surface of the wafer is greatly decreased, detection efficiency and precision are both high, and operation is convenient and rapid; in addition, due to the multi-direction movement platform, the to-be-detected wafer can be moved in multiple directions, the comprehensive scanning detection of the laser confocal scanning measurement head is greatly facilitated, the labor intensity of operators can be lowered, the time required by detection is shortened, and work efficiency is greatly improved.

Description

technical field [0001] The invention relates to the technical field of wafer surface detection, in particular to an optical waveguide wafer surface detection device. Background technique [0002] Optical fiber communication system is the core of today's information age. Various optical waveguide devices and optoelectronic devices are required in this system. The optical part of these devices usually has three structures, namely micro-optical structure, fiber optic structure and integrated optical structure. The integrated optical device in the integrated optical structure, also known as the optical waveguide device, refers to the optical waveguide device manufactured by the Planar Lightwave Circuit (PLC) process, which realizes light wave emission, detection, One or several functions such as coupling, beam splitting, wavelength division multiplexing and demultiplexing, filtering, and switching. Optical waveguide wafers are the front-end process products of optical waveguide...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/66H01L21/67
CPCH01L21/67288H01L22/10H01L22/12
Inventor 郑煜开小超夏冰心李白冰段吉安
Owner 黄山博蓝特半导体科技有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com