OLED device and preparing method thereof

A device and backplane technology, which is applied in the field of OLED devices and its preparation, can solve the problems of poor edge sealing, water vapor and oxygen penetration, etc.

Inactive Publication Date: 2016-07-27
KUNSHAN GO VISIONOX OPTO ELECTRONICS CO LTD
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  • Abstract
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Problems solved by technology

[0003] In the technical path of various thin-film packaging, there is a problem that the sealing performance

Method used

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  • OLED device and preparing method thereof
  • OLED device and preparing method thereof
  • OLED device and preparing method thereof

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[0023] The present invention will be described in detail below with reference to the specific embodiments shown in the drawings. It is worth noting that the embodiments described below do not limit the present invention, and the structural, method, or functional transformations made by those skilled in the art based on these embodiments are all included in the protection scope of the present invention.

[0024] See Figure 1 to Figure 3 As shown, the OLED device 100 includes a TFT backplane 1 and a display unit located on the TFT backplane 1. The display unit includes an anode layer 5, a cathode layer 6, and an OLED 7 located between the anode layer 5 and the cathode layer 6, The TFT backplane 1 is provided with a fence 8 surrounding the display unit; the TFT backplane 1 and the fence 8 are provided with an inorganic film 101; the display unit is located above the inorganic film 101 in the fence 8; The inorganic film 101 above the fence 8 and the display unit are deposited with a...

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Abstract

The invention relates to an OLED device and a preparation method thereof. The OLED device includes a TFT backplane and a display unit on the TFT backplane, the display unit includes an anode layer, a cathode layer, and an OLED between the anode layer and the cathode layer, and the TFT backplane is provided with a The surrounding wall of the display unit; the TFT backplane and the surrounding wall are provided with an inorganic film; the display unit is located above the inorganic film in the surrounding wall; a packaging medium layer is deposited above the inorganic film and the display unit; the inorganic film and the display unit The packaging medium layer forms an internal sealing system to enclose the display unit. With such an arrangement, a complete inorganic layer dam can be formed around the OLED, and a longer water vapor permeation path can be formed between the packaging medium layer and the contact of the underlying inorganic film, thereby achieving a better effect of blocking water vapor.

Description

technical field [0001] The invention relates to the field of OLEDs, in particular to an OLED device and a preparation method thereof. Background technique [0002] Organic Light Emitting Diode (OLED) has excellent performance and wide application, but due to the nature of the material, it is easily deteriorated after being attacked by water vapor and oxygen, so it requires high packaging performance. Traditional glass cover or metal cover packaging has achieved good results, but it is not suitable for some important or potential applications, such as top emission OLED display technology, flexible OLED display technology or flexible OPV. For this reason, the industry has developed thin-film packaging technology, using one or several layers of vacuum-deposited thin films to block water and oxygen, without blocking the path of light emission or incidence, and without affecting the flexibility of the substrate. [0003] In various technical paths of thin film packaging, there i...

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Application Information

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IPC IPC(8): H01L27/32H01L51/52H01L51/56
Inventor 陈红彭兆基金波
Owner KUNSHAN GO VISIONOX OPTO ELECTRONICS CO LTD
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