A kind of pcb anti-breaking board milling plating groove and application method thereof
A technology for PCB boards and plating tanks, applied in printed circuit stress/deformation reduction, structural connection of printed circuits, printed circuit components, etc., can solve problems such as production troubles, lower production efficiency, scrapped connecting ribs, and scrapped boards. The effect of reducing production cost and improving production efficiency
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Embodiment 1
[0025] A PCB anti-break plate milling and plating tank, including a tank body, the tank body includes a unit tank 1, a tank bottom and a tank wall surrounding the tank bottom, and the tank wall includes a first tank wall 21 and a second tank wall 22. At least two unloading grooves 3 are arranged between the first groove wall and the second groove wall, and a slot hole 4 is arranged between the unit groove and the second groove wall, and one side of the groove hole is correspondingly arranged Said unloading groove is arranged.
[0026] Further, the horizontal distance between the stress relief grooves 3 is 30 mm.
[0027] Further, the length of the slot 4 is 4 mm, and the width of the slot is 3 mm.
[0028] Further, the length of the force relief groove 3 is greater than or equal to the width of the slot hole 4 .
[0029] Further, the distance between the edge of the first groove wall 21 and the edge of the first groove wall 21 of the stress relief groove 3 is 2 mm; The dist...
Embodiment 2
[0039] This embodiment provides a PCB breakage prevention board milling plating groove, its structure and application method are consistent with the embodiment 1.
[0040] The surface coating of the unloading groove of the milling and plating groove of the PCB anti-breaking plate in the present embodiment is made of the raw materials of the following parts by weight: 5 parts of epoxy resin, 2 parts of methyl methacrylate, 5 parts of calcium carbonate, 1 part of defoamer, 5 parts of propylene glycol, 1 part of dicumyl peroxide, 8 parts of pentaerythritol, 3 parts of carbon 60, 5 parts of nickel oxide, 12 parts of nano diatomite, 5 parts of silicon dioxide, polypropylene short fiber 3 parts, 0.5 parts of coalescent, 1 part of polyoxyethylene stearate, 9 parts of butyl acetate, 1 part of ethyl acetate, and 10 parts of silicone propionate emulsion.
Embodiment 3
[0042] This embodiment provides a PCB breakage prevention board milling plating groove, its structure and application method are consistent with the embodiment 1.
[0043] The surface coating of the unloading groove of the milling and plating groove of the PCB anti-breaking plate in the present embodiment is made of the raw materials of the following parts by weight: 8 parts of epoxy resin, 6 parts of methyl methacrylate, 10 parts of calcium carbonate, 3 parts of defoamer, 8 parts of propylene glycol, 5 parts of dicumyl peroxide, 12 parts of pentaerythritol, 10 parts of carbon 60, 15 parts of nickel oxide, 15 parts of nano diatomite, 7 parts of silicon dioxide, polypropylene short fiber 9 parts, 2.5 parts of coalescent, 4 parts of polyoxyethylene stearate, 11 parts of butyl acetate, 5 parts of ethyl acetate, and 12 parts of silicone propionate emulsion.
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