Injection process for metalized polypropylene film dielectric capacitor

A polypropylene film and capacitor technology, used in film/thick film capacitors, multilayer capacitors, fixed capacitor parts and other directions, can solve the problems of low work efficiency and low accuracy of perfusion, save perfusion time, improve Good perfusion efficiency and fluidity

Inactive Publication Date: 2016-08-03
ZHENGZHOU UNIVERSITY OF AERONAUTICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The invention solves the problems of low work efficiency and low accuracy of pouring amount in manual capacitor epoxy pouring

Method used

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  • Injection process for metalized polypropylene film dielectric capacitor
  • Injection process for metalized polypropylene film dielectric capacitor

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Experimental program
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Effect test

Embodiment 1

[0026] A filling process for a metallized polypropylene film dielectric capacitor, comprising the following steps: the filling head of epoxy resin is close to the inner wall of the capacitor shell, the epoxy resin filling flows from top to bottom along the inner wall of the capacitor shell, and the epoxy resin The liquid level of the filling glue rises gradually, and the position of the perfusion head is also continuously moved up, and finally the perfusion is completed; the perfusion head is a perfusion tube, and the outer wall of the perfusion tube is surrounded by an arc-shaped outer wall 1 and a plane outer wall 2 (see figure 1 ), when the inner wall of the capacitor shell is a curved surface, the arc-shaped outer wall 1 is consistent with the arc of the inner wall of the capacitor shell, so that the outer wall of the perfusion tube and the inner wall of the capacitor shell are bonded; the epoxy resin filling glue includes the following parts by weight Prepared from raw mat...

Embodiment 2

[0031] A filling process for a metallized polypropylene film dielectric capacitor, comprising the following steps: the epoxy resin filling glue filling head is close to the inner wall of the capacitor shell, the epoxy resin filling glue flows from top to bottom along the inner wall of the capacitor shell, and the epoxy resin The liquid level of the filling glue rises gradually, and the position of the filling head is also continuously moved up, and finally the filling is completed; the filling head is a filling tube, and the outer wall of the filling tube is surrounded by an arc-shaped outer wall and a flat outer wall. When the inner wall of the capacitor shell When it is a curved surface, the arc-shaped outer wall is consistent with the arc of the inner wall of the capacitor shell, so that the outer wall of the perfusion tube and the inner wall of the capacitor shell are bonded together; the epoxy resin filling glue is prepared from the following raw materials in parts by weigh...

Embodiment 3

[0036]A filling process for a metallized polypropylene film dielectric capacitor, comprising the following steps: the filling head of epoxy resin is close to the inner wall of the capacitor shell, the epoxy resin filling flows from top to bottom along the inner wall of the capacitor shell, and the epoxy resin The liquid level of the filling glue rises gradually, and the position of the filling head is also continuously moved up, and finally the filling is completed; the filling head is a filling tube, and the outer wall of the filling tube is surrounded by a curved outer wall and a flat outer wall. When the inner wall of the capacitor shell When it is a plane, the plane outer wall is bonded to the plane inner wall of the capacitor case; the epoxy resin filling glue is prepared from the following raw materials in parts by weight: bisphenol A epoxy resin E-5150 parts, poly 13 parts of ester resin, 7 parts of dimethyl methyl phosphate, 36 parts of silicon micropowder, 38 parts of ...

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Abstract

The invention discloses an injection process for a metalized polypropylene film dielectric capacitor .The injection process includes the following steps that an injection head for an epoxy resin filling adhesive is closely attached to the inner wall of a capacitor shell, the epoxy resin filling adhesive flows downwards along the inner wall of the capacitor shell, the level of the epoxy resin filling adhesive rises gradually, the position of the injection head shifts upwards constantly, and finally injection is completed .An injection tube serves as the injection head, and the outer wall of the injection tube is defined by an arc outer wall and a planar outer wall .The epoxy resin filling adhesive is prepared from, by weight, 45-60 parts of epoxy resin, 10-18 parts of polyester resin, 5-10 parts of a fire retardant, 30-45 parts of a filling material, 30-45 parts of a diluent, 0.5-1.5 parts of a defoaming agent, 22-35 parts of a curing agent and 0-1.5 parts of a curing accelerator .The epoxy resin filling adhesive is uniformly injected without bubbles inside, the injection process is simple, and the injection efficiency is high.

Description

technical field [0001] The invention belongs to the technical field of capacitor perfusion, and in particular relates to a perfusion process of metallized polypropylene film dielectric capacitors. Background technique [0002] In recent years, metallized polypropylene film dielectric capacitors have become more and more widely used. In the manufacturing process of metallized polypropylene film dielectric capacitors, the epoxy infusion process of capacitors is a very important process. The capacitors are mainly made of liquid epoxy resin materials. Potting between the shell and the core to improve capacitance and insulation performance, and improve partial discharge and heat resistance, the current epoxy potting of capacitors has low work efficiency, and during the potting process, bubbles are easily generated inside the epoxy resin , Poor perfusion effect. [0003] Chinese patent CN103617889A discloses a copper foil film capacitor, including a core, a copper wire and a shel...

Claims

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Application Information

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IPC IPC(8): C08L63/00C08L75/06C08L83/04C08K13/02C08K5/521C08K3/36C08K5/1515C08K5/1539H01G4/33H01G4/224
CPCC08L63/00C08L2201/08C08L2203/206C08L2205/03H01G4/224H01G4/33C08L75/06C08L83/04C08K13/02C08K5/521C08K3/36C08K5/1515C08K5/1539
Inventor 苗满香宋辉崔建锋
Owner ZHENGZHOU UNIVERSITY OF AERONAUTICS
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