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Metalized package electronic ceramic printing slurry and preparation method thereof

A technology for encapsulating electronics and ceramic printing, which is applied in the field of paste for printing metallized encapsulating electronic ceramics and its preparation, can solve the problems of weak surface tension, poor solderability, and weak surface force of joint ceramics, and achieve strong surface tension and surface Strong force and strong solderability

Inactive Publication Date: 2016-08-10
李建辉
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In the printing of electronic ceramics, suitable printing paste is needed. Most of the existing printing pastes are poor in solderability, weak in bonding ceramic surface, and weak in surface tension, which brings great inconvenience to production.

Method used

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  • Metalized package electronic ceramic printing slurry and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] Weigh the raw materials according to the weight percentage of the raw materials, molybdenum powder: 85%, manganese powder: 8%, porcelain powder: 7%, and mix them evenly; add the uniformly mixed raw materials to the centrifugal ball mill, and control the milling time at 60 hours ; Pass the ball-milled material through a 300-mesh sieve, and take the material under the sieve; heat the material under the sieve to 28°C, and then add a solvent that accounts for 6% of the material weight. The solvent is a mixture of terpineol and cellulose; The materials are put into a stirring ball mill for 48 hours under constant temperature stirring and ball milling to obtain metalized packaging electronic ceramic printing slurry.

Embodiment 2

[0025] Weigh the raw materials according to the weight percentages of the raw materials, molybdenum powder: 86%, manganese powder: 7%, porcelain powder: 7%, and mix them evenly; add the uniformly mixed raw materials to the centrifugal ball mill, and the milling time is controlled at 55 hours ; Pass the ball-milled material through a 300-mesh sieve and take the material under the sieve; heat the material under the sieve to 27°C, and then add a solvent that accounts for 6% of the weight of the material. The solvent is a mixture of terpineol and cellulose; The materials are put into a stirring ball mill for 48 hours under constant temperature stirring and ball milling to obtain metalized packaging electronic ceramic printing slurry.

Embodiment 3

[0027] Weigh the raw materials according to the weight percentages of the raw materials, molybdenum powder: 87%, manganese powder: 6%, porcelain powder: 7%, and mix them evenly; add the uniformly mixed raw materials to the centrifugal ball mill, and control the milling time at 50 hours ; Pass the ball-milled material through a 300-mesh sieve, and take the material under the sieve; heat the material under the sieve to 29°C, and then add a solvent that accounts for 6% of the weight of the material, and the solvent is a mixture of terpineol and cellulose; The materials are put into a stirring ball mill for 48 hours under constant temperature stirring and ball milling to obtain a metalized packaging electronic ceramic printing slurry.

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Abstract

The invention provides a preparation method of metalized package electronic ceramic printing slurry .The preparation method includes the following steps that raw materials are weighed according to weight part percentages, and the raw materials are mixed to be uniform; the raw materials which are mixed to be uniform are added to a centrifugal ball mill, wherein the ball milling time is controlled to be 48 hours or above; the ball-milled raw materials pass through a 300-mesh screen, and screened-out materials are taken; the screened-out materials are heated to 27 DEG C to 29 DEG C, and then a solvent accounting for 6% of the weight of the materials is added, wherein the solvent is a mixture of terpilenol and cellulose; the materials to which the solvent is added are placed in a stirring ball mill to be stirred and ball-milled for 48 hours at constant temperature, and then the metalized package electronic ceramic printing slurry is obtained .Solderability is high, joint ceramic surface force is high, and surface tension is high .

Description

Technical field [0001] The invention belongs to a slurry for printing electronic ceramics, in particular to a slurry for printing metalized packaging electronic ceramics and a preparation method thereof. Background technique [0002] In recent years, with the miniaturization of electronic devices, electronic components have become smaller and smaller. Therefore, the existing light-sensing process is used when making electrodes, so that electronic components can be miniaturized while maintaining good performance. . When applying the photosensitive process, the photosensitive conductive paste coated on the base material sheet has more organic resin (photosensitive adhesive). In the traditional lamination process of inductive components, the laminated green body is completed and cut When cutting into a single product, it is easy to produce more sticky sheets, especially on inductance products with surface marks (Mark), cutting sticky sheets has a greater impact on the product quali...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C04B41/85
CPCC04B41/85C04B41/5098
Inventor 李建辉
Owner 李建辉
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