Ceramic member for high-frequency and high-speed ceramic packaging housing, housing, lamination mold and sintering mold
A technology of ceramic packaging and ceramic parts, applied in electrical components, electric solid devices, semiconductor devices, etc., can solve problems such as poor microwave radio frequency performance, and achieve the effect of eliminating structural reliability damage, achieving transmission, and excellent microwave radio frequency performance.
Active Publication Date: 2016-08-10
THE 13TH RES INST OF CHINA ELECTRONICS TECH GRP CORP
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Problems solved by technology
Using precision screen printing technology to print metallized graphics, multi-layer green ceramic sheets are stacked and laminated according to a predetermined order, and then cut into individual green porcelain pieces by cutting equipment, and the green porcelain pieces are fired at high temperature to obtain ceramic pieces , the housing obtained by the above method has poor microwave radio frequency performance due to the use of via holes to lead the pins of the ceramic outer and inner chips to the outside of the housing.
Method used
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[0021] The technical solutions in the embodiments of the present invention are clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0022] In the following description, a lot of specific details are set forth in order to fully understand the present invention, but the present invention can also be implemented in other ways different from those described here, and those skilled in the art can do it without departing from the meaning of the present invention. By analogy, the present invention is therefore not limited to the specific examples disclosed below.
[0023] Such as figure ...
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Abstract
The invention discloses a ceramic member for a high-frequency and high-speed ceramic packaging housing, a housing, a lamination mold and a sintering mold, and relates to the technical field of semiconductor microelectronic device fabrication. The ceramic member comprises at least a first ceramic piece and a second ceramic piece. The first ceramic piece comprises a first horizontal ceramic piece and a second horizontal ceramic piece. The first horizontal ceramic piece and the second horizontal ceramic piece are connected with each other via a first transition ceramic piece. The second ceramic piece comprises a third horizontal ceramic piece and a fourth horizontal ceramic piece. The third horizontal ceramic piece and the fourth horizontal ceramic piece are connected with each other via a second transition ceramic piece. The second ceramic piece is integrally attached to the upper surface of the first ceramic piece. By means of the ceramic member, a pin of a chip inside the housing can be led out of the housing. Therefore, the radio frequency transmission loss is reduced and the fluctuation-free RF signal transmission is realized.
Description
technical field [0001] The invention relates to the technical field of semiconductor microelectronic device preparation, in particular to a ceramic part for a high-frequency and high-speed ceramic packaging shell, a shell, a lamination mold and a sintering mold. Background technique [0002] The packaging shell of the semiconductor chip is a main component of the integrated circuit. It not only plays the role of mechanical protection for the chip and the transition connection of the chip electrodes to the outside, but also requires the correct realization of various functional parameters of the chip and the use of the circuit. The environmental conditions, as well as the characteristics of the circuit, all play a fundamental role in guaranteeing. Packages for semiconductor chips include metal packages, plastic packages, ceramic packages, and the like. Ceramic packaging shells are extremely stable in terms of thermal, electrical, and mechanical properties, and can provide hi...
Claims
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IPC IPC(8): H01L21/48H01L23/055
CPCH01L23/055H01L21/48
Inventor 刘林杰郑欣乔志壮丁飞任才华吴亚光张义政白洪波陈军伟
Owner THE 13TH RES INST OF CHINA ELECTRONICS TECH GRP CORP