High-temperature-resistant microwave absorbing material based on linear copper particle composite

A technology of microwave absorbing materials and linear copper particles, which is applied in other chemical processes, chemical instruments and methods, etc., can solve the problems of material microwave absorption performance decline and magnetic permeability reduction, and achieve good microwave absorption performance and large effective Permeability, good performance effect

Inactive Publication Date: 2016-08-17
NANJING UNIV OF POSTS & TELECOMM
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Problems solved by technology

[0013] The purpose of the present invention is to overcome the problem that the magnetic permeability of the existing microwave absorbing material becomes smaller or even tends to zero at high temperature, thereby reducing the microwave absorbing performance of the material

Method used

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  • High-temperature-resistant microwave absorbing material based on linear copper particle composite
  • High-temperature-resistant microwave absorbing material based on linear copper particle composite
  • High-temperature-resistant microwave absorbing material based on linear copper particle composite

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Embodiment Construction

[0026] The following is a further description of the technical solution of the high-performance and high-temperature-resistant microwave absorbing material provided by the present invention through specific implementation methods.

[0027] The structure of the microwave absorbing material with good performance and high temperature resistance is shown in Figure-1. The structure is a composite of linear copper particles with a concentration lower than the percolation threshold. The diameter of the linear copper particles is about 80 microns and the length is 4 mm or so.

[0028] A commercial enameled wire with a diameter of about 80 microns is cut into particles with a length of about 4 mm. Copper particles, silicon dioxide airgel and polytetrafluoroethylene resin particle raw materials are evenly mixed in a certain proportion, wherein the concentration of copper particles is 0.9 times of its percolation threshold. Microporous, 1 mm thick film is formed by bulking and stretchin...

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Abstract

The invention discloses a high-temperature-resistant microwave absorbing material based on a linear copper particle composite. The material is composed of a linear copper particle with a concentration lower than the percolation threshold and a porous material mainly composed of polytetrafluoroethylene. Among them, the wire-shaped copper particles have a diameter of about 80 microns and a length of about 4 mm; the porous material mainly composed of polytetrafluoroethylene has low dielectric constant (about 1.6) and high temperature resistance. The invention aims to apply a thin layer with a thickness of 1 mm on the surface of a metal block, realize a microwave energy reflectivity lower than -5dB in the frequency range of 15-20GHz, and have the characteristics of high temperature resistance.

Description

technical field [0001] The invention relates to the fields of electromagnetic functional materials and microwave technology, in particular to a high temperature resistant microwave absorbing material based on a linear copper particle composite. Background technique [0002] Commonly used microwave absorbing materials, whose magnetic response is derived from soft magnetic materials, are easily affected by temperature. When the temperature is higher than the Curie temperature, the magnetism disappears and the wave-absorbing performance of the material drops significantly. [0003] Wire-like metal particle composites can have strong magnetic responses due to the interconnection of currents between particles. Assuming linear particles with length and radius 2a and b respectively, with concentration p and dielectric constant ε d The medium mixture, its effective permeability can be expressed as: [0004] μ e = 1 ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09K3/00
CPCC09K3/00
Inventor 陈将伟徐健李江南吴杰梁峰
Owner NANJING UNIV OF POSTS & TELECOMM
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