Capacitive flexible pressure sensor based on microstructural dielectric layers and preparation method of capacitive flexible pressure sensor

A pressure sensor and micro-structured technology, applied in the field of sensors, can solve the problem that the sensitivity and stability of the sensor need to be further improved, and achieve the effects of being conducive to application promotion, low energy consumption and low cost

Active Publication Date: 2016-08-17
XIAMEN ZHONGKE WISDOW MEDICAL TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The disadvantage of this technical solution is that the sensitivity and stability of the sensor need to be further improved
[0005] However, the theoretical and experimental methods o

Method used

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  • Capacitive flexible pressure sensor based on microstructural dielectric layers and preparation method of capacitive flexible pressure sensor
  • Capacitive flexible pressure sensor based on microstructural dielectric layers and preparation method of capacitive flexible pressure sensor
  • Capacitive flexible pressure sensor based on microstructural dielectric layers and preparation method of capacitive flexible pressure sensor

Examples

Experimental program
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Example Embodiment

[0064] Example 1:

[0065] (1) Preparation of flexible substrate

[0066] The commercially available PDMS monomer and curing agent (Dow Corning, SYLGARD 184, USA) are thoroughly mixed according to a mass ratio of 10:1, using OSP-100 Meyer rod (OSP-100, Shijiazhuang OSP Machinery Technology Co., Ltd. ) Coat on the surface of commercially available inkjet printing photo paper (Canon, LU-101 Professional Suede Photo Paper, Japan), then place it in a vacuum oven at room temperature for 5 minutes to remove air bubbles in the coating, and then cure at 70°C 2 It was peeled off the surface of the photographic paper to obtain a flexible substrate with a thickness of 100 μm.

[0067] (2) Preparation of conductive layer and electrode

[0068] Using screen printing method (screen printing machine: OS-500FB, China Ou Laite Printing Machinery Industry Co., Ltd.), printed nano silver conductive ink (AP02, Beijing Beiyin Zhongyuan Technology Co., Ltd.) on the surface of the flexible substrate to obt...

Example Embodiment

[0079] Example 2:

[0080] (1) Preparation of flexible substrate

[0081] The commercially available PDMS monomer and curing agent (Dow Corning, SYLGARD 184, USA) were thoroughly mixed according to a mass ratio of 10:1, and OSP-1.5 Meyer rod (OSP-1.5, Shijiazhuang OSP Machinery Technology Co., Ltd. ) Coat on the surface of commercially available inkjet printing photo paper (Canon, LU-101 Professional Suede Photo Paper, Japan), then place it in a vacuum oven at room temperature for 5 minutes to remove air bubbles in the coating, and then cure at 70°C 2 It was peeled off from the surface of the paper to obtain a flexible substrate with a thickness of 1 μm.

[0082] (2) Preparation of conductive layer and electrode

[0083] The conductive layer of carbon nanotubes (TNWPM, Chengdu Organic Chemistry Co., Ltd., Chinese Academy of Sciences) was coated and prepared on the surface of the flexible substrate with OSP-1.5 Meyer rod (OSP-1.5, Shijiazhuang OSP Machinery Technology Co., Ltd.), with...

Example Embodiment

[0090] Example 3:

[0091] (1) Preparation of flexible substrate

[0092] The commercially available PDMS monomer and curing agent (Dow Corning, SYLGARD 184, USA) are thoroughly mixed according to the mass ratio of 10:1, and the OSP-50 Meyer rod (OSP-50, Shijiazhuang OSP Machinery Technology Co., Ltd. ) Coat the surface of a commercially available PET film (Lucky, China, with a thickness of 100μm), then place it in a vacuum oven at room temperature for 5 minutes to remove air bubbles in the coating, then cure at 70°C for 2 hours, and remove it from the surface of the paper Peel off to obtain a flexible substrate with a thickness of 50 μm.

[0093] (2) Preparation of conductive layer and electrode

[0094] The gold coating is deposited on the surface of the flexible substrate by chemical deposition, and its surface resistance is 5Ω / sq. Silver conductive glue (Ablestik, Ablebond 84-1Limisr4) is used to form upper and lower conductive electrodes on the two conductive layers, and copper...

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Abstract

The invention relates to a capacitive flexible pressure sensor based on microstructural dielectric layers and a preparation method of the capacitive flexible pressure sensor and belongs to the technical field of sensors. The capacitive flexible pressure sensor comprises an upper flexible substrate, a lower flexible substrate, an upper conducting layer and a lower conducting layer, wherein the upper conducting layer is attached to the inner surface of the upper flexible substrate, the lower conducting layer is attached to the inner surface of the lower flexible substrate, and the microstructural dielectric layers are arranged between the upper conducting layer and the lower conducting layer. Compared with the prior art, different microstructural dielectric layers are designed for the capacitive flexible pressure sensor, the sensor performance can be effectively regulated according to change of conditions such as shape, size, distribution and the like of each dielectric layer microstructure, and preparation of the capacitive flexible pressure sensors with different sensitivity and test ranges is realized. Besides, the microstructures prepared with methods such as microcapsule foaming, impressing, replica transfer, 3D printing and the like are low in cost, high in efficiency, low in energy consumption and particularly suitable for large-area and large-scale production, and application and popularization of the sensor are facilitated.

Description

technical field [0001] The invention relates to a capacitive flexible pressure sensor and a preparation method thereof, in particular to a capacitive flexible pressure sensor based on a microstructured dielectric layer and a preparation method thereof, belonging to the technical field of sensors. Background technique [0002] Capacitive flexible pressure sensor is a new type of high-sensitivity mechanical sensor. Due to its characteristics of flexibility, high sensitivity and fast response, it is expected to be widely used in wearable electronics, intelligent bionics, medical health monitoring and other fields. For example, Apple recently released the Iphone 6S smart phone in 2016. Its touch screen adopts pressure tactile sensor technology, and users can invoke different applications by applying different pressures to the touch screen. In addition, some wearable electronic devices for monitoring the health status of the elderly also make extensive use of capacitive flexible ...

Claims

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Application Information

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IPC IPC(8): G01L1/14G01L9/12G01L19/00
CPCG01L1/142G01L9/12G01L19/00
Inventor 莫黎昕李路海翟庆彬李正博王振国
Owner XIAMEN ZHONGKE WISDOW MEDICAL TECH CO LTD
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