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Capacitive flexible pressure sensor based on microstructural dielectric layers and preparation method of capacitive flexible pressure sensor

A pressure sensor and micro-structured technology, applied in the field of sensors, can solve the problem that the sensitivity and stability of the sensor need to be further improved, and achieve the effects of being conducive to application promotion, low energy consumption and low cost

Active Publication Date: 2016-08-17
XIAMEN ZHONGKE WISDOW MEDICAL TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The disadvantage of this technical solution is that the sensitivity and stability of the sensor need to be further improved
[0005] However, the theoretical and experimental methods of microstructuring the dielectric layer of the flexible pressure sensor and using different microstructures of the dielectric layer to control its performance have not been reported.

Method used

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  • Capacitive flexible pressure sensor based on microstructural dielectric layers and preparation method of capacitive flexible pressure sensor
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  • Capacitive flexible pressure sensor based on microstructural dielectric layers and preparation method of capacitive flexible pressure sensor

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Experimental program
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Effect test

Embodiment 1

[0065] (1) Preparation of flexible substrate

[0066] The commercially available PDMS monomer and curing agent (Dow Corning, SYLGARD 184, the United States) were fully mixed according to the mass ratio of 10:1, and OSP-100 Meyer rods (OSP-100, Shijiazhuang OSP Machinery Technology Co., Ltd. ) on the surface of commercially available inkjet printing paper (Canon, LU-101 professional suede photo paper, Japan), and then placed in a vacuum oven at room temperature for 5 minutes to remove air bubbles in the coating, and then cured at 70 ° C for 2 hours, and peeled off from the surface of the photo paper to obtain a flexible substrate with a thickness of 100 μm.

[0067] (2) Preparation of conductive layer and electrodes

[0068] Using screen printing (screen printing machine: OS-500FB, China Outlet Printing Machinery Industry Co., Ltd.), print nano-silver conductive ink (AP02, Beijing Beiyin Zhongyuan Technology Co., Ltd.) on the surface of the flexible substrate to obtain a condu...

Embodiment 2

[0080] (1) Preparation of flexible substrate

[0081] The commercially available PDMS monomer and curing agent (Dow Corning, SYLGARD 184, the United States) were fully mixed according to a mass ratio of 10:1, and OSP-1.5 Meyer rods (OSP-1.5, Shijiazhuang OSP Machinery Technology Co., Ltd. ) on the surface of commercially available inkjet printing paper (Canon, LU-101 professional suede photo paper, Japan), and then placed in a vacuum oven at room temperature for 5 minutes to remove air bubbles in the coating, and then cured at 70 ° C for 2 hours, and peeled off from the surface of the photo paper to obtain a flexible substrate with a thickness of 1 μm.

[0082] (2) Preparation of conductive layer and electrodes

[0083] On the surface of the flexible substrate, the carbon nanotube conductive layer (TNWPM, Chengdu Organic Chemistry Co., Ltd., Chinese Academy of Sciences) was prepared by coating the OSP-1.5 Meyer rod (OSP-1.5, Shijiazhuang OSP Machinery Technology Co., Ltd.), w...

Embodiment 3

[0091] (1) Preparation of flexible substrate

[0092] The commercially available PDMS monomer and curing agent (Dow Corning, SYLGARD 184, the United States) were fully mixed according to the mass ratio of 10:1, and the OSP-50 Meyer rod (OSP-50, Shijiazhuang OSP Machinery Technology Co., Ltd. ) was coated on the surface of a commercially available PET film (Lucky, China, with a thickness of 100 μm), then placed in a vacuum oven at room temperature for 5 minutes to remove air bubbles in the coating, and then cured at 70°C for 2 hours, and removed from the surface of the photo paper Peel off to obtain a flexible substrate with a thickness of 50 μm.

[0093] (2) Preparation of conductive layer and electrodes

[0094] A gold coating is prepared by depositing on the surface of the flexible substrate by means of chemical deposition, and its surface resistance is 5Ω / sq. Use silver conductive glue (Ablestik, Ablebond 84-1Limisr4) to form upper and lower conductive electrodes on the t...

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Abstract

The invention relates to a capacitive flexible pressure sensor based on microstructural dielectric layers and a preparation method of the capacitive flexible pressure sensor and belongs to the technical field of sensors. The capacitive flexible pressure sensor comprises an upper flexible substrate, a lower flexible substrate, an upper conducting layer and a lower conducting layer, wherein the upper conducting layer is attached to the inner surface of the upper flexible substrate, the lower conducting layer is attached to the inner surface of the lower flexible substrate, and the microstructural dielectric layers are arranged between the upper conducting layer and the lower conducting layer. Compared with the prior art, different microstructural dielectric layers are designed for the capacitive flexible pressure sensor, the sensor performance can be effectively regulated according to change of conditions such as shape, size, distribution and the like of each dielectric layer microstructure, and preparation of the capacitive flexible pressure sensors with different sensitivity and test ranges is realized. Besides, the microstructures prepared with methods such as microcapsule foaming, impressing, replica transfer, 3D printing and the like are low in cost, high in efficiency, low in energy consumption and particularly suitable for large-area and large-scale production, and application and popularization of the sensor are facilitated.

Description

technical field [0001] The invention relates to a capacitive flexible pressure sensor and a preparation method thereof, in particular to a capacitive flexible pressure sensor based on a microstructured dielectric layer and a preparation method thereof, belonging to the technical field of sensors. Background technique [0002] Capacitive flexible pressure sensor is a new type of high-sensitivity mechanical sensor. Due to its characteristics of flexibility, high sensitivity and fast response, it is expected to be widely used in wearable electronics, intelligent bionics, medical health monitoring and other fields. For example, Apple recently released the Iphone 6S smart phone in 2016. Its touch screen adopts pressure tactile sensor technology, and users can invoke different applications by applying different pressures to the touch screen. In addition, some wearable electronic devices for monitoring the health status of the elderly also make extensive use of capacitive flexible ...

Claims

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Application Information

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IPC IPC(8): G01L1/14G01L9/12G01L19/00
CPCG01L1/142G01L9/12G01L19/00
Inventor 莫黎昕李路海翟庆彬李正博王振国
Owner XIAMEN ZHONGKE WISDOW MEDICAL TECH CO LTD
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