Tooling for gas-phase cleaning of electronic devices with cavity
A technology of electronic devices and gas phase cleaning, which is applied in the direction of cleaning methods and appliances, chemical instruments and methods, etc., can solve the problems of troublesome development, discounted cleaning effect, severe ultrasonic energy attenuation, etc., and achieve the effect of convenient placement and strong versatility
Active Publication Date: 2018-11-20
TIANSHUI 749 ELECTRONICS
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Problems solved by technology
Due to the large variety of electronic devices, various sizes and pin structures, it is required to design U-shaped groove tooling with different bottom groove sizes for different products. Moreover, it is not conducive to the flow and effective separation of cleaning liquid, resulting in a greatly reduced cleaning effect
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Embodiment Construction
[0024] Below in conjunction with accompanying drawing, the present invention is described in further detail:
[0025] According to the process characteristics of gas phase cleaning, the figure 1 When the electronic device with a cavity shown in the figure is cleaned by gas phase, two details need to be paid attention to: first, the product should be placed with its mouth facing down to avoid liquid accumulation in cavity 1, and pin 2 will not be restricted; There will be cleaning dead ends. To meet these two requirements, the product needs to be clamped at a specific angle. Just for this purpose, the present invention designs a tooling for vapor-phase cleaning of electronic devices with a cavity.
[0026] A tooling for gas-phase cleaning of electronic devices with a cavity, including a bottom positioning bar 4, a movable connecting piece 5, and a barrier frame 3. The movable connecting piece 5 is divided into a high-position movable connecting piece and a low-position movable...
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A tool for gas-phase cleaning of electronic devices with cavities is divided into two types, according to one type of the tool, a rotating pair is used as a main structure, and according to the second type of the tool, a moving pair is used as a main structure. According to the design of the tool, the problem that the mold machining amount is large due to multiple product varieties by means of a traditional tool is solved; only one tool needs to be developed for the electronic devices, similar in size, with the cavities, the product pin structures are not limited, and high universality is achieved. Meanwhile, the problem that cavity liquid accumulation is generated due to improper arrangement of the electronic devices with the cavities in the gas-phase cleaning process is solved. The frame type structural design is adopted by the whole tool, the fluidity of cleaning liquid in the soaking cleaning process is effectively improved, and attenuation of ultrasonic energy is greatly reduced; and meanwhile, the electronic devices to be cleaned are placed with the openings downwards at a specific angle, cleaning liquid is prevented from staying in the cavities of the electronic devices due to improper arrangement in the whole cleaning process is avoided, and the cleaning liquid and the tool can be conveniently separated.
Description
technical field [0001] The invention relates to the technical field of integrated circuit packaging, in particular to a tool for gas-phase cleaning of electronic devices with cavities. Background technique [0002] With the continuous development of science and technology, people pay more and more attention to industrial cleaning technology. Cleaning operations tend to be mechanized and automated, which greatly improves working conditions and reduces labor intensity. As an efficient cleaning method, gas phase cleaning is more and more widely used in industrial cleaning. Commonly used gas-phase cleaning equipment includes two links: immersion cleaning and steam rinsing. Soaking and cleaning process: Electronic devices are immersed in cleaning solvents, and under the combined action of the inherent cleaning ability of the cleaning solvent itself and ultrasonic waves, the flux residues and oil stains in the electronic devices are removed. Steam rinsing link: by heating the ga...
Claims
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IPC IPC(8): B08B13/00
CPCB08B13/00
Inventor 邢宝华
Owner TIANSHUI 749 ELECTRONICS