Processing of semiconductor devices

Abstract

One method of thinning a wafer includes using a grinding process to thin the wafer. After the grinding process, the wafer has a first non-uniformity in thickness. The thinned wafer is etched using a plasma process. The wafer has a second non-uniformity in thickness after the etching process. The second unevenness is smaller than the first unevenness.

Description

technical field [0001] The present invention relates generally to semiconductor fabrication, and in particular embodiments, to the processing of semiconductor devices. Background technique [0002] Semiconductor devices are used in many electronic and other applications. Semiconductor devices may include integrated circuits formed on semiconductor wafers. Alternatively, semiconductor devices may be formed as monolithic devices, such as discrete devices. Semiconductor devices are formed on a semiconductor wafer by processes such as depositing thin films of various types of materials on the semiconductor wafer, patterning the thin films of materials, doping selective regions of the semiconductor wafer, and the like. [0003] In conventional semiconductor manufacturing processes, a large number of semiconductor devices are fabricated in a single wafer. After the fabrication processes at the device level and interconnection level are complete, the semiconductor devices on the...

AI Technical Summary

Problems solved by technology

Process variations can lead to yield loss as the performance of individual devices or entire chips becomes out of bounds and can therefore dramatically increase production costs

A challenge in semiconductor manufacturing is the improvement or reduction of process variation while reducing machining margins

Images