A printed circuit board manufacturing equipment based on laser groove processing technology

Abstract

The invention discloses laser groove machining process-based printed circuit board fabrication equipment, which comprises a rack, a conveying mechanism, lifting mechanisms and a laser device, wherein the rack is sequentially provided with a conveying trough, an ablation chamber and a detection chamber from bottom to top; the rack comprises a left rack and a right rack; the left rack and the right rack are symmetrically arranged on the left and right; the conveying trough is formed in the lower parts of the left rack and the right rack; the conveying mechanism is transversely arranged in the conveying trough; a pair of lifting mechanisms in the vertical direction is arranged in a gap between the front side walls of the left rack and the right rack and the gap between the rear side walls; the laser device is located on the left outer side wall and the right outer side wall of the ablation chamber; the laser device comprises a left laser device and a right laser device; the left laser device is arranged on the left side wall of the corresponding left rack; and the right laser device is arranged on the right side wall of the corresponding right rack. Two surfaces of a base material can be processed; the laser groove machining process-based printed circuit board fabrication equipment is fast and convenient; the base material can be sequentially ablated and detected from bottom to top through the conveying mechanism and the lifting mechanisms; the equipment cost is reduced; and the work efficiency is improved.

Description

Technical field: [0001] The invention relates to the technical field of printed circuit board processing, in particular to a printed circuit board manufacturing equipment based on a laser groove processing technology. Background technique: [0002] With the rapid development of high-density packaging substrates, it is required to reduce the chip area and packaging area of ​​components, and it is inevitable to improve packaging efficiency. To meet the characteristics of light, thin, short, small, and flexible structures of printed circuit boards, reducing the line width / line spacing on the substrate and making finer lines has become an option. In conventional circuit production, side erosion, long process, and difficult sewage treatment have always been unsolvable problems. Excessive side erosion not only affects the appearance of the line, but even cannot meet the integrity requirements for high-frequency and high-speed signals in line transmission. conduction requirements....

AI Technical Summary

Problems solved by technology

CNC drilling can drill holes of all materials, but when the hole diameter is less than 250 μm, the drilling cost increases exponentially, which is not suitable for mass production of micro-holes; CO2 laser drilling can process holes with a diameter of more than 50 μm, and the production efficiency is high, but CO2 The laser is only suitable for the resin dielectric layer. For micro-holes between 50 μm and 75 μm, it is difficult to control. After drilling, there are many residual films or carbide residues in the dielectric material; The inside is clean and free of carbonization, and the cost of making holes between 25 μm and 125 μm is not high, but the cost of using UV laser to make large-aperture drilling increases exponentially

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