Packaging structure and packaging method for three-dimensional system-in-package

A system-level packaging and packaging structure technology, applied in microstructure devices, processing microstructure devices, microstructure technology, etc., can solve the problem of inability to meet the low-cost needs of consumers, and the high cost of metal packaging and ceramic packaging

Active Publication Date: 2018-11-06
TSINGHUA UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the cost of both metal packaging and ceramic packaging is high, which cannot meet consumers' demand for low cost

Method used

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  • Packaging structure and packaging method for three-dimensional system-in-package
  • Packaging structure and packaging method for three-dimensional system-in-package
  • Packaging structure and packaging method for three-dimensional system-in-package

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Embodiment Construction

[0026] Specific embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings. It should be understood that the specific embodiments described here are only used to illustrate and explain the present invention, and are not intended to limit the present invention.

[0027] In the present invention, unless otherwise specified, the orientation words used such as "upper, lower, bottom, top" are usually defined in the normal use of the packaging structure provided by the present invention, specifically refer to Figure 1 to Figure 8b Orientation shown on the drawing. It should be noted that these orientation words are only used to illustrate the present invention, and are not used to limit the present invention.

[0028] figure 1 is a schematic diagram of a package structure provided according to an embodiment of the present invention. Such as figure 1 As shown, the package structure 100 may include: a first carrier 101 , w...

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PUM

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Abstract

The invention discloses a packaging structure and packaging method for three-dimensional system-level packaging. The packaging structure includes: a first carrier board; a first component group, which is arranged on the upper surface of the first carrier board and is electrically connected to the wiring structure on the first carrier board, and the first component group includes cavity-encapsulated components And / or non-cavity packaged components; the annular molded body is arranged on the upper surface of the first carrier, and forms a cavity with the first carrier; the second carrier is arranged on the annular molded body, and Covering the cavity; the second component group is arranged on the lower surface of the second carrier and is electrically connected to the wiring structure on the second carrier. The second component group includes cavity-encapsulated components, and the cavity-encapsulated Type components are accommodated in the cavity; the first conductive connector connects the wiring structure of the second carrier board and the wiring structure of the first carrier board, so that the electrical interconnection between the first component group and the second component group even. Therefore, a three-dimensional system-in-package with a cavity can be realized at a lower cost.

Description

technical field [0001] The present invention relates to the field of three-dimensional system-level packaging, in particular to a packaging structure and a packaging method for three-dimensional system-level packaging. Background technique [0002] System-in-Package (SiP) is a general term for a packaging method. The International Semiconductor Roadmap (ITRS) defined SiP in 2011 as: System-in-Package is a combination of multiple active devices with different functions. Integrated in one package, a single package can provide multiple functions of a system or subsystem. SiP can optionally contain various components. Among these components, some components need to be packaged in a cavity, such as micro-electromechanical systems (MEMS) devices. At present, cavity packaging mostly relies on metal packaging technology or ceramic packaging technology. With the development of the electronics industry, while consumers require electronic products to be short, small, light, and thin...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/08H01L23/13H01L23/14H01L23/538H01L21/48H01L21/768B81B7/00B81C3/00
CPCH01L23/5386H01L23/5389H01L24/82H01L21/4803H01L23/08H01L23/13H01L23/145B81B7/0006B81B7/0074B81C3/001H01L2224/82986H01L2924/15311H01L2224/16145H01L2224/16225H01L2224/48091H01L2224/48227H01L2924/00014
Inventor 李诚蔡坚王谦陈瑜
Owner TSINGHUA UNIV
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