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High-voltage sub-module based on MMC circuit topology

A high-voltage sub-module and circuit technology, applied in emergency protection circuit devices, electrical components, output power conversion devices, etc., can solve problems such as increasing switching losses, and achieve small circuit stray inductance, low cost, and pipeline failure small risk effect

Pending Publication Date: 2016-09-21
CHINA EPRI SCIENCE & TECHNOLOGY CO LTD +2
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although the di / dt and dv / dt caused by voltage and current overshoot can be adjusted by adjusting the gate drive circuit V GE change, but at the expense of increased switching losses

Method used

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  • High-voltage sub-module based on MMC circuit topology
  • High-voltage sub-module based on MMC circuit topology
  • High-voltage sub-module based on MMC circuit topology

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Embodiment Construction

[0055] In order to make the objectives, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be described clearly and completely in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments It is a part of the embodiments of the present invention, not all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative work shall fall within the protection scope of the present invention.

[0056] The following describes a high-voltage sub-module based on the MMC circuit topology provided by the embodiments of the present invention with reference to the accompanying drawings.

[0057] figure 1 It is a schematic structural diagram of a high-voltage sub-module based on MMC circuit topology in an embodiment of the present inv...

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Abstract

The invention provides a high-voltage sub-module based on the MMC circuit topology, and the sub-module comprises a DC support capacitor, a power switch device, and a lamination busbar. Leading-out terminals of the DC support capacitor comprise two terminal strips, and the terminal strips are arranged at an outgoing line of a housing in the DC support capacitor in an asymmetric manner. The lamination busbar, the leading-out terminals and the switch devices are disposed on the same plane. Compared with the prior art, the sub-module provided by the invention employs a lamination busbar connection mode, is small in loop stray inductance, is small in pulse peak, is compact in structure, and is high in reliability. The leading-out terminals of the capacitor are not symmetric, thereby effectively reducing the size of an external lamination busbar, and achieving the low cost. The switch devices are disposed on the same heat radiator, and there is only one incoming heat dissipation pipe water connector and one outgoing heat dissipation pipe water connector, so the risk of pipe faults is small.

Description

Technical field [0001] The invention relates to the technical field of MMC high-voltage sub-module structure design, in particular to a high-voltage sub-module based on MMC circuit topology. Background technique [0002] Modular Multilevel Converter (MMC) has been widely used in the power industry. The MMC topology inherits the modularity of the H-bridge cascaded structure. Multi-level output is achieved through the cascade of power units. It can be powered by a single AC power supply or a single DC power supply, and does not require a multi-winding transformer; by adjusting the sub-module The number of series connections can adapt to changes in voltage and power levels, and can be extended to any level of output. Its flexibility is good; there are many output levels, the output voltage is very smooth and close to the ideal sine waveform, which can effectively reduce electromagnetic interference (EMI) and the total harmonic distortion (THD) of the output waveform, and the networ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H02M1/10H02H7/12H05K7/20
CPCH02H7/12H02M1/10H05K7/20263H05K7/20272
Inventor 韩天绪王承明燕瀈常忠
Owner CHINA EPRI SCIENCE & TECHNOLOGY CO LTD
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