High-voltage sub-module based on MMC circuit topology

A high-voltage sub-module and circuit technology, applied in emergency protection circuit devices, electrical components, output power conversion devices, etc., can solve problems such as increasing switching losses, and achieve small circuit stray inductance, low cost, and pipeline failure small risk effect

Pending Publication Date: 2016-09-21
CHINA EPRI SCIENCE & TECHNOLOGY CO LTD +2
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although the di / dt and dv / dt caused by voltage and current overshoot can be adjusted by adjusting the gate drive circuit V GE change, but at the expense of increased switching losses

Method used

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  • High-voltage sub-module based on MMC circuit topology
  • High-voltage sub-module based on MMC circuit topology
  • High-voltage sub-module based on MMC circuit topology

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Embodiment Construction

[0055] In order to make the objectives, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be described clearly and completely in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments It is a part of the embodiments of the present invention, not all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative work shall fall within the protection scope of the present invention.

[0056] The following describes a high-voltage sub-module based on the MMC circuit topology provided by the embodiments of the present invention with reference to the accompanying drawings.

[0057] figure 1 It is a schematic structural diagram of a high-voltage sub-module based on MMC circuit topology in an embodiment of the present inv...

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Abstract

The invention provides a high-voltage sub-module based on MMC circuit topology, including a DC support capacitor, a power switch device and a laminated busbar; the lead-out terminals of the DC support capacitor include two rows of terminals, and the two rows of terminals are asymmetrically arranged on the DC support capacitor The outlet of the middle shell; the power switching device includes two switching devices installed on the same radiator; the laminated busbar, lead-out terminals and switching devices are all arranged on the same plane. Compared with the prior art, the high-voltage sub-module based on the MMC circuit topology provided by the present invention adopts the laminated busbar connection mode, the stray inductance of the circuit is small, the impact peak is small, the structure is compact, and the reliability is high; the capacitor lead-out terminal Asymmetry can effectively reduce the size of external laminated busbars and achieve low cost; the switching devices are installed on the same radiator, and there are only one inlet and one outlet heat pipe water connectors, so the risk of pipeline failure is small.

Description

Technical field [0001] The invention relates to the technical field of MMC high-voltage sub-module structure design, in particular to a high-voltage sub-module based on MMC circuit topology. Background technique [0002] Modular Multilevel Converter (MMC) has been widely used in the power industry. The MMC topology inherits the modularity of the H-bridge cascaded structure. Multi-level output is achieved through the cascade of power units. It can be powered by a single AC power supply or a single DC power supply, and does not require a multi-winding transformer; by adjusting the sub-module The number of series connections can adapt to changes in voltage and power levels, and can be extended to any level of output. Its flexibility is good; there are many output levels, the output voltage is very smooth and close to the ideal sine waveform, which can effectively reduce electromagnetic interference (EMI) and the total harmonic distortion (THD) of the output waveform, and the networ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H02M1/10H02H7/12H05K7/20
CPCH02M1/10H02H7/12H05K7/20263H05K7/20272
Inventor 韩天绪王承明燕瀈常忠
Owner CHINA EPRI SCIENCE & TECHNOLOGY CO LTD
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