Power device parallel cooling structure and motor controller applying same

Abstract

The invention discloses a power device parallel cooling structure and a motor controller applying the same. The power device parallel cooling structure comprises a heat dissipation base and a plurality of power devices, wherein the plurality of power devices are installed on the heat dissipation base at intervals, and a heat dissipation water channel is arranged in the heat dissipation base. The power device parallel cooling structure is characterized in that the heat dissipation water channel comprises a water inlet, a water inlet channel, a plurality of branch water channels, a water outlet channel and a water outlet, wherein the water inlet is communicated with the water inlet channel, the water outlet is communicated with the water outlet channel, the plurality of branch water channels are arranged side by side between the water inlet channel and the water outlet channel, the water inlet channel is connected with the water outlet channel in parallel by means of the plurality of branch water channels, and the cross sectional area of the water inlet channel is decreased gradually from the water inlet, thereby enabling temperature difference of different high-power devices to be minimum, giving full play to the performance of the high-power devices and a cooling system, and meeting requirements of integration and miniaturization of new-energy products.

Description

Technical field: [0001] The invention relates to a parallel cooling structure of power devices and a motor controller applied thereto, belonging to the technical field of motor vehicles. Background technique: [0002] In the field of new energy, the demand for the capacitance of high-power devices such as IGBTs is increasing year by year, which puts forward higher requirements for the heat dissipation performance of the cooling system. If the heat generated by the high-power device cannot be dissipated in time, the high-power device cannot work normally. In addition, the market has put forward requirements for integration, integration and miniaturization of new energy products such as motor controllers and motors. When multiple high-power devices are used and arranged closely, it is necessary to pass high-power devices The heat flux density of the heat sink is constantly increasing to meet its heat dissipation requirements. [0003] At present, there are at least the follo...

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Problems solved by technology

[0003] At present, there are at least the following problems in the cooling system of high-power devices in series: when using the same cooling channel to cool multiple high-power devices of the same working condition, the chip temperature of the high-power devices near the entrance of the cooling channel will be relatively low. Low, while the chip temperature of high-power devices near the exit of the cooling channel is relatively high

If the temperature difference between the two is large, and the chip with a relatively high temperature needs to be detected during temperature detection, the performance of high-power devices near the entrance cannot be fully utilized.

However, when using the same cooling channel to cool multiple high-power devices with different capacitance values, the heat dissipation conditions of the high-power devices with large losses are tight, while the heat dissipation conditions of high-power devices with small losses are redundant, then The heat dissipation performance of the cooling system cannot be fully utilized

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