MEMS (Micro-electromechanical Systems) wafer cutting method

Abstract

The invention provides an MEMS (Micro-electromechanical Systems) wafer cutting method. The cutting method comprises the steps of providing a first MEMS wafer; binding a first structure layer on the surface of the first MEMS wafer; forming a first scribing slot which penetrates the upper surface and lower surface of the first structure layer, and a first blocking part which blocks the first scribing slot and is composed of the first structure layer on the first structure layer by employing a photoetching technology; providing a second MEMS wafer, and binding the second MEMS wafer on the first structure layer; and carrying out cutting along the scribing slot by employing a laser cutting technology, thereby separating an MEMS chip and a fake sheet. Compared with the prior art, the MEMS wafer cutting method provided by the invention has the advantages that the influence of the structure layer in the inactive area of the MEMS wafer on laser focus is remarkably reduced when laser cutting is carried out; and the cutting efficiency is improved.

Description

【Technical field】 [0001] The invention relates to a cutting process of a semiconductor device, in particular to a cutting method of a MEMS wafer. 【Background technique】 [0002] Micro-electromechanical systems (MEMS) technology mainly includes micro-mechanisms, micro-sensors, micro-actuators and corresponding processing circuits. High-tech cutting-edge disciplines developed on the basis of [0003] The development of MEMS technology has opened up a new technical field and industry. Micro sensors, micro actuators, micro components, micro mechanical optical devices, vacuum microelectronic devices, power electronic devices, etc. made by MEMS technology are widely used in aviation, aerospace, automobile, There are very broad application prospects in biomedicine, environmental monitoring, military affairs and almost all fields that people come into contact with. MEMS technology is developing into a huge industry, just like the great changes that the microelectronics industry an...

AI Technical Summary

Problems solved by technology

[0007] The technical problem to be solved by the present invention is to provide a cutting method for MEMS wafers, which is used to solve the existing cutting method because the structural layer completely covers the inactive area of ​​the MEMS wafer, which seriously affects the laser focus during laser cutting. As a result, the inactive area of ​​the MEMS wafer cannot be cut normally and the MEMS chips close to the inactive area cannot be separated.

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