Ultra-thin heat pipe for cooling mobile phone and manufacturing method thereof

Abstract

The invention discloses an ultrathin heat pipe for heat dissipation of a mobile phone and a manufacturing method of the ultrathin heat pipe. The ultrathin heat pipe comprises a metal pipe body, a wire mesh wick and a working medium, wherein the tail portion and the head of the metal pipe body are sealed in a welded manner. A pipe section of the metal pipe body is flat after phase change flattening technology is carried out, so that an airtight inner cavity of the ultrathin heat pipe is formed. The wire mesh wick is formed from a spiral wire mesh or a planar wire mesh or formed by sintering the spiral wire mesh and the planar wire mesh compositely. Generally, the working medium is the liquid which is high in vaporization latent heat and large in specific heat capacity. According to the inner wire mesh structure of the ultrathin heat pipe, a gas channel and a liquid channel are separated and unobstructed, and the overall thickness of the ultrathin heat pipe totally adapts to the narrow heat dissipation space in the mobile phone; the capillary force of the wire mesh wick is large, the backflow resistance of the working medium is small, and therefore the heat transfer property is good; and the wire mesh structure is dense, not prone to disperse and good in mechanical property, and therefore bending and flattening forming of the ultrathin heat pipe are easy. The manufacturing method of the ultrathin heat pipe is simple and stable in technology, suitable for batch production and high in efficiency and yield.

Description

technical field [0001] The invention belongs to the technical field of heat conduction, and relates to a heat pipe technology, in particular to an ultra-thin heat pipe for cooling a mobile phone and a manufacturing method thereof. Background technique [0002] As mobile phones become more intelligent, integrated, and thinner, the performance requirements of their processors, such as data processing capabilities, communication network capabilities, high-definition image processing capabilities, and high-resolution display output capabilities, are more demanding. The power consumption will also increase accordingly, and the thickness of the current mobile phone is generally below 8 mm; due to the thin thickness, more stringent requirements are put forward for the heat dissipation of the heating elements inside the device, mainly CPU, camera, etc. The serious heating problem of the mobile phone caused by untimely heat dissipation has greatly damaged the user's operating comfort...

AI Technical Summary

Problems solved by technology

The liquid-absorbing core of the ultra-thin heat pipe adopts a powder sintered structure, and its overall thickness is too thick to be suitable for the narrow heat dissipation space inside the mobile phone. In addition, when the bending process is performed, the sintered and bonded powder layer on the inner wall of the tube is very easy to fall off; At the same time, the powder filling process in its manufacturing process is difficult to apply to ultra-thin heat pipes with long length (powder is difficult to evenly fill into the tail of the tube body) and thin thickness (the powder layer is required to be thinner and difficult to fill), and when the wall thickness of the tube body When it is thinner, after the sintering process, the material of the pipe body is in a soft state of heat treatment, and it is very difficult to carry out the second process of necking (at this time, the pipe body is prone to distortion and collapse)

Therefore, the ultra-thin heat pipe of this patent is too thick to be used for heat dissipation of mobile phones. At the same time, its ultra-thin heat pipe manufacturing process cannot be used to make ultra-thin heat pipes with a thinner thickness (less than 0.8 mm).

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