Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Layout characteristic parameter extraction method for graphic data of grid point edge region

A technology of edge area and graphic data, which is applied in the field of layout feature parameter extraction including grid edge area graphic data, can solve the problems of geometric feature parameter extraction errors and other problems, achieve simple extraction steps, improve accuracy, and facilitate batching The effect of the operation

Active Publication Date: 2016-10-12
SHANGHAI HUALI MICROELECTRONICS CORP
View PDF3 Cites 9 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In such a situation, the geometric figure 203 is cut into two small line width figures, which will obviously have a huge erroneous impact on the subsequent extraction of geometric feature parameters

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Layout characteristic parameter extraction method for graphic data of grid point edge region
  • Layout characteristic parameter extraction method for graphic data of grid point edge region
  • Layout characteristic parameter extraction method for graphic data of grid point edge region

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0031] In order to make the content of the present invention clearer and easier to understand, the content of the present invention will be described in detail below in conjunction with specific embodiments and accompanying drawings.

[0032] image 3 A flowchart schematically shows a method for extracting layout feature parameters including graphic data of grid edge regions according to a preferred embodiment of the present invention.

[0033] like image 3 As shown, according to the preferred embodiment of the present invention, the method for extracting the layout feature parameters including the graphic data of the grid edge area includes:

[0034] The first step S1: firstly divide the original design layout data into grid points, and the division of grid points includes at least four times, such as Figure 4 Shown:

[0035] The grid point of the first batch of grid point division 401 is based on the coordinate (0, 0) as the starting point, the grid point size is w*w, a...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a layout characteristic parameter extraction method for graphic data of a grid point edge region. The method comprises the steps of performing grid point division on original design layout data for at least four times, and during the grid point division, expanding all edges of a grid point from inside to outside of a graph to form an annular region; distinguishing a graph in the grid point from an edge graph of the grid point; calculating the weight line width, perimeter and density of the graph in the grid point to obtain calculation results and influence factor localization; calculating the weight line width, perimeter and density of the graph in the grid point edge region to obtain calculation results and influence factor localization; and calculating geometric characteristic parameter values of all grid points.

Description

technical field [0001] The present invention relates to the field of semiconductor design and manufacture, in particular to the field of DFM (Design ForManufacture) manufacturability graphic design; more specifically, the present invention relates to a method for extracting layout characteristic parameters including graphic data of grid edge regions. Background technique [0002] CMP-Chemical Mechanical Polishing process hotspot analysis is an important part of DFM-Design for Manufacturability (DFM-Design for Manufacturability) technology, and its importance to yield improvement has been fully recognized by the industry. The CMP process is mainly used to maintain the thickness of the metal layer and the flatness of the wafer to accommodate the ever-shrinking photolithography process window. As the size of the chip continues to shrink, the complexity of the pattern continues to increase, especially after the use of low dielectric constant (Low-k) materials to replace the sili...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): G06F17/50
CPCG06F30/392
Inventor 朱忠华阚欢魏芳朱骏吕煜坤张旭升
Owner SHANGHAI HUALI MICROELECTRONICS CORP
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com