Quality control device and method for controlling quality control device
A technology of quality management and inspection equipment, applied in the direction of program control, auxiliary equipment, comprehensive factory control, etc.
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no. 1 approach
[0066] Next, an embodiment of the quality control system in the aforementioned surface mount production line will be described.
[0067] The quality management system of the first embodiment is a system that identifies the main cause of quality degradation in a product based on the inspection results output by the inspection devices 210 to 240, and automatically feeds back appropriate installation parameters to production equipment. The mounting parameters are parameters used when printing solder and mounting components, for example, define values such as offset when components are arranged, solder application pressure, and the like.
[0068] Here, while referring to figure 2 While explaining the data flow. As mentioned above, the solder printing inspection device 210 is a device for checking whether solder is normally printed on the substrate, and the component inspection device 220 is a device for checking whether electronic components are normally mounted on the substra...
no. 2 approach
[0114] In the first embodiment, as described in steps S22 to S23 , Cpk is calculated from the distribution of measured values in print inspection and component inspection, and when Cpk is less than 1.0, it is determined that an abnormality has occurred. On the other hand, in the second embodiment, the presence or absence of an abnormality is actually judged by using the Cpk of the lot in which a defective product has occurred as a threshold value.
[0115] In the second embodiment, the process capability index (hereinafter referred to as Cpk, which is the threshold value when abnormality judgment is performed in step S23) is set by the following processing. T ), when the calculated Cpk is less than Cpk T In the case of , it is judged that an abnormality has occurred.
[0116] Additionally, the following processing is independent of Figure 8 processing is executed. This process is performed, for example, at the end of each batch of production.
[0117] (1) Cases where th...
no. 3 approach
[0127] In the first and second embodiments, the Figure 5 The shown inspection item-related table is stored in the analyzer 260 in advance, and inspection items related to defects are acquired by referring to the table. On the other hand, the third embodiment is an embodiment in which an inspection item correlation table is automatically created by obtaining the correlation between the measured value in the completed inspection and the measured value in the previous process.
[0128] In the third embodiment, by Figure 9 The flow shown generates the inspection item related table used in step S21. in addition, Figure 9 The processing shown is independent of the Figure 8 processing is executed. In the present embodiment, this process is performed every time the production of a batch is completed, but it may be performed every predetermined time or every predetermined number of products produced.
[0129] In the case where there is a product determined to be defective in t...
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