A kind of semiconductor device and its manufacturing method, electronic device
A manufacturing method and technology for electronic devices, which are applied in semiconductor/solid-state device manufacturing, semiconductor devices, circuits, etc., can solve problems such as TiN loss, content limitation, and main spacer damage.
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Embodiment 1
[0069] Below, refer to Figures 3a-3g and Figure 4 The detailed steps of an exemplary method of the method for manufacturing a semiconductor device proposed by the present invention will be described. Among them, 3a-3g are schematic cross-sectional views of graphics formed in the key steps of the manufacturing method of the semiconductor device according to the embodiment of the present invention; Figure 4 It is a flow chart of a method for manufacturing a semiconductor device proposed by an embodiment of the present invention.
[0070] First, step 301 is performed to provide a semiconductor substrate 301, on which a gate including a high-K dielectric layer, a cover layer, a dummy gate and a hard mask layer are respectively formed on the active region and the isolation region of the semiconductor substrate 301. structure, the gate structure includes an NMOS gate structure and a PMOS gate structure.
[0071] As an example, such as Figure 3aAs shown, in this embodiment, t...
Embodiment 2
[0119] The present invention also provides a semiconductor device, which is prepared by the method described in Embodiment 1. No TiN loss occurs in the semiconductor device, metal gate protrusion does not occur after the metal gate is formed, no etch punch-through occurs during dummy gate removal, and metal Al does not occur after the metal gate is formed Diffusion further improves the yield of the semiconductor device.
Embodiment 3
[0121] The present invention also provides an electronic device, including the semiconductor device described in Embodiment 2. Wherein, the semiconductor device is the semiconductor device described in Embodiment 2, or the semiconductor device obtained according to the preparation method described in Embodiment 1.
[0122] The electronic device of this embodiment can be any electronic product or equipment such as mobile phone, tablet computer, notebook computer, netbook, game console, TV set, VCD, DVD, navigator, camera, video recorder, voice recorder, MP3, MP4, PSP, etc. , can also be any intermediate product including the semiconductor device. The electronic device according to the embodiment of the present invention has better performance due to the use of the above-mentioned semiconductor device.
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